BC56PA-Q_SER auto medium power
80 V, 1 A NPN medium power transistors
NPN medium power transistor in a SOT1061 (DFN2020-3) leadless very small Surface-Mounted Device (SMD) plastic package.
Features and benefits
High collector current capability IC and ICM
Three current gain selections
High power dissipation capability
Exposed heatsink for excellent thermal and electrical conductivity
Leadless very small SMD plastic package with medium power capability
Qualified according to AEC-Q101 and recommended for use in automotive applications
Applications
Linear voltage regulators
MOSFET drivers
Low-side switches
Power management
Amplifiers
Battery-driven devices
参数类型
| 型号 | Package version | Package name | Size (mm) | channel type (e) | Ptot (mW) | VCEO [max] (V) | IC [max] (mA) | hFE [min] | hFE [max] | TJ [max] (°C) | fT [min] (MHz) | Automotive qualified |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BC56-10PA-Q | SOT1061 | DFN2020-3 | 2 x 2 x 0.65 | NPN | 420.0 | 80.0 | 1000.0 | 63.0 | 160.0 | 150 | 100.0 | Y |
| BC56-16PA-Q | SOT1061 | DFN2020-3 | 2 x 2 x 0.65 | NPN | 420.0 | 80.0 | 1000.0 | 100.0 | 250.0 | 150 | 100.0 | Y |
| BC56PA-Q | SOT1061 | DFN2020-3 | 2 x 2 x 0.65 | NPN | 420.0 | 80.0 | 1000.0 | 63.0 | 250.0 | 150 | 100.0 | Y |
封装
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| BC56-10PA-Q | BC56-10PA-QX (934664529115) |
Active | BK |
DFN2020-3 (SOT1061) |
SOT1061 |
REFLOW_BG-BD-1
|
SOT1061_115 |
| BC56-16PA-Q | BC56-16PA-QX (934664521115) |
Active | BL |
DFN2020-3 (SOT1061) |
SOT1061 |
REFLOW_BG-BD-1
|
SOT1061_115 |
| BC56PA-Q | BC56PA-QX (934664530115) |
Active | AZ |
DFN2020-3 (SOT1061) |
SOT1061 |
REFLOW_BG-BD-1
|
SOT1061_115 |
环境信息
| 型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| BC56-10PA-Q | BC56-10PA-QX | BC56-10PA-Q |
|
|
| BC56-16PA-Q | BC56-16PA-QX | BC56-16PA-Q |
|
|
| BC56PA-Q | BC56PA-QX | BC56PA-Q |
|
|
文档 (6)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT1061 | 3D model for products with SOT1061 package | Design support | 2022-06-02 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DFN2020-3_SOT1061_mk | plastic, thermal enhanced ultra thin small outline package; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body | Marcom graphics | 2017-01-28 |
| SOT1061 | plastic, leadless thermal enhanced ultra thin small outline package; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body | Package information | 2022-05-27 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
支持
如果您需要设计/技术支持，请告知我们并填写 应答表 我们会尽快回复您。
模型
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| SOT1061 | 3D model for products with SOT1061 package | Design support | 2022-06-02 |
Ordering, pricing & availability
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