Features and benefits
- High current (max. 0.5 A)
- Low voltage (max. 80 V)
- Integrated diode and resistor.
- AEC-Q101 qualified
Applications
- Industrial switching applications such as: - -Print hammer - -Solenoid - -Relay and lamp drivers. 
参数类型
| 型号 | Package version | Package name | Size (mm) | hFE [min] | toff (ns) | fT [min] (MHz) | Polarity | IC [max] (mA) | VCES [max] (V) | Ptot [max] (mW) | hFE [max] | Automotive qualified | 
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BSP62 | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | 2000 | 1500 | 200 | PNP | 500 | 80 | 1250 | >2000 | N | 
| BSP62-Q | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | 2000 | 1500 | PNP | 500 | 1250 | 80 | 200 | 2000 | 
封装
| 型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 | 
|---|---|---|---|---|---|---|---|
| BSP62 | BSP62,115 (933969480115) | Active | BSP62 |   SC-73 (SOT223) | SOT223 | REFLOW_BG-BD-1 WAVE_BG-BD-1 | SOT223_115 | 
| BSP62-Q | BSP62-QX (934664942115) | Active | BSP62 |   SC-73 (SOT223) | SOT223 | REFLOW_BG-BD-1 WAVE_BG-BD-1 | SOT223_115 | 
下表中的所有产品型号均已停产 。
| 型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 | 
|---|---|---|---|---|---|---|---|
| BSP60 | BSP60,115 (933986350115) | Discontinued / End-of-life | BSP60 |   SC-73 (SOT223) | SOT223 | REFLOW_BG-BD-1 WAVE_BG-BD-1 | SOT223_115 | 
| BSP61 | BSP61,115 (933986360115) | Discontinued / End-of-life | BSP61 |   SC-73 (SOT223) | SOT223 | REFLOW_BG-BD-1 WAVE_BG-BD-1 | SOT223_115 | 
文档 (12)
| 文件名称 | 标题 | 类型 | 日期 | 
|---|---|---|---|
| BSP60 | PNP Darlington transistor | Data sheet | 2018-05-02 | 
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 | 
| mgd624 | Block diagram: BSP60, BSP61, BSP62, PMST2907A | Block diagram | 2009-11-03 | 
| SOT223 | 3D model for products with SOT223 package | Design support | 2019-01-22 | 
| 75017516 | NXP secure microcontroller family SmartMX2 | Leaflet | 2014-03-23 | 
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 | 
| SC-73_SOT223_mk | plastic, surface-mounted package with increased heatsink; 4 leads; 4.6 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body | Marcom graphics | 2017-01-28 | 
| DERATSMD | Power Derating Curves for SMDs; General | Other type | 1999-05-06 | 
| LSYMTRA | Letter Symbols - Transistors; General | Other type | 1999-05-06 | 
| SOT223 | plastic, surface-mounted package with increased heatsink; 4 leads; 2.3 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body | Package information | 2022-05-30 | 
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 | 
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 | 
