 
74AHCU04
Hex unbuffered inverter
The 74AHCU04 is high-speed Si-gate CMOS devices and is pin compatible with low power Schottky TTL (LSTTL). It is specified in compliance with JEDEC standard No. 7A.
The 74AHCU04 is a general purpose hex unbuffered inverter. Each of the six inverters is a single stage.
Features and benefits
- Low power dissipation 
- Balanced propagation delays 
- Inputs accepts voltages higher than VCC 
- ESD protection: - HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V 
- CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V 
 
- Multiple package options 
- Specified from -40 °C to +125 °C 
参数类型
| 型号 | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name | 
|---|---|---|---|---|---|---|---|---|---|---|---|
| 74AHCU04BQ | 2.0 - 5.5 | CMOS | ± 8 | 60 | 6 | low | -40~125 | 106 | 19.7 | 74 | DHVQFN14 | 
| 74AHCU04D | 2.0 - 5.5 | CMOS | ± 8 | 60 | 6 | low | -40~125 | 108 | 19.7 | 66 | SO14 | 
| 74AHCU04PW | 2.0 - 5.5 | CMOS | ± 8 | 60 | 6 | low | -40~125 | 141 | 7.4 | 67.2 | TSSOP14 | 
封装
| 型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 | 
|---|---|---|---|---|---|---|---|
| 74AHCU04BQ | 74AHCU04BQ,115 (935285551115) | Active | AHU04 |   DHVQFN14 (SOT762-1) | SOT762-1 | SOT762-1_115 | |
| 74AHCU04D | 74AHCU04D,118 (935263042118) | Active | 74AHCU04D |   SO14 (SOT108-1) | SOT108-1 | SO-SOJ-REFLOW SO-SOJ-WAVE WAVE_BG-BD-1 | SOT108-1_118 | 
| 74AHCU04PW | 74AHCU04PW,118 (935263043118) | Active | AHCU04 |   TSSOP14 (SOT402-1) | SOT402-1 | SSOP-TSSOP-VSO-WAVE | SOT402-1_118 | 
环境信息
| 型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 
|---|---|---|---|---|
| 74AHCU04BQ | 74AHCU04BQ,115 | 74AHCU04BQ |  |   | 
| 74AHCU04D | 74AHCU04D,118 | 74AHCU04D |  |   | 
| 74AHCU04PW | 74AHCU04PW,118 | 74AHCU04PW |  |   | 
文档 (17)
| 文件名称 | 标题 | 类型 | 日期 | 
|---|---|---|---|
| 74AHCU04 | Hex unbuffered inverter | Data sheet | 2024-01-25 | 
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 | 
| SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 | 
| SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 | 
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 | 
| ahcu04 | ahcu04 IBIS model | IBIS model | 2013-04-08 | 
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 | 
| DHVQFN14_SOT762-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; 0.5 mm pitch; 2.5 mm x 3 mm x 0.85 mm body | Marcom graphics | 2017-01-28 | 
| SO14_SOT108-1_mk | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Marcom graphics | 2017-01-28 | 
| TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 | 
| SOT762-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body | Package information | 2023-04-05 | 
| SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 | 
| SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 | 
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 | 
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 | 
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 | 
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 | 
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