74AUP1G07
Low-power buffer with open-drain output
The 74AUP1G07 is a single buffer with open-drain output.
Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times.
This device ensures a very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V.
This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.
Features and benefits
Wide supply voltage range from 0.8 V to 3.6 V
High noise immunity
CMOS low power dissipation
Complies with JEDEC standards:
JESD8-12 (0.8 V to 1.3 V)
JESD8-11 (0.9 V to 1.65 V)
JESD8-7 (1.65 V to 1.95 V)
JESD8-5 (2.3 V to 2.7 V)
JESD8C (2.7 V to 3.6 V)
Low static power consumption; ICC = 0.9 μA (maximum)
Latch-up performance exceeds 100 mA per JESD 78 Class II
Overvoltage tolerant inputs to 3.6 V
Low noise overshoot and undershoot < 10 % of VCC
IOFF circuitry provides partial Power-down mode operation
Multiple package options
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Specified from -40 °C to +85 °C and -40 °C to +125 °C
参数类型
| 型号 | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 74AUP1G07GM | 0.8 - 3.6 | CMOS | 1.9 | 70 | 1 | ultra low | -40~125 | 311 | 8.1 | 157 | XSON6 |
| 74AUP1G07GN | 0.8 - 3.6 | CMOS | 1.9 | 70 | 1 | ultra low | -40~125 | 334 | 207 | XSON6 | |
| 74AUP1G07GS | 0.8 - 3.6 | CMOS | 1.9 | 70 | 1 | ultra low | -40~125 | 321 | 215 | XSON6 | |
| 74AUP1G07GW | 0.8 - 3.6 | CMOS | 1.9 | 70 | 1 | ultra low | -40~125 | 309 | 95.6 | 179 | TSSOP5 |
| 74AUP1G07GX | 0.8 - 3.6 | CMOS | 1.9 | 70 | 1 | ultra low | -40~125 | 322 | 191 | X2SON5 | |
| 74AUP1G07GX4 | 0.8 - 3.6 | CMOS | 1.9 | 70 | 1 | ultra low | -40~125 | X2SON4 | |||
| 74AUP1G07GZ | 0.8 - 3.6 | CMOS | ultra low | -40~125 | 323 | 35.7 | 204.3 | XSON5 |
封装
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| 74AUP1G07GM | 74AUP1G07GM,115 (935279018115) |
Active | pS |
XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_115 |
| 74AUP1G07GM,132 (935279018132) |
Active | pS | SOT886_132 | ||||
| 74AUP1G07GN | 74AUP1G07GN,132 (935291716132) |
Active | pS |
XSON6 (SOT1115) |
SOT1115 |
REFLOW_BG-BD-1
|
SOT1115_132 |
| 74AUP1G07GS | 74AUP1G07GS,132 (935292831132) |
Active | pS |
XSON6 (SOT1202) |
SOT1202 |
REFLOW_BG-BD-1
|
SOT1202_132 |
| 74AUP1G07GW | 74AUP1G07GW,125 (935279017125) |
Active | pS |
TSSOP5 (SOT353-1) |
SOT353-1 |
WAVE_BG-BD-1
|
SOT353-1_125 |
| 74AUP1G07GX | 74AUP1G07GX,125 (935297926125) |
Active | pS |
X2SON5 (SOT1226-3) |
SOT1226-3 | SOT1226-3_125 | |
| 74AUP1G07GX4 | 74AUP1G07GX4Z (935340115147) |
Active | pS |
X2SON4 (SOT1269-2) |
SOT1269-2 | SOT1269-2_147 | |
| 74AUP1G07GZ | 74AUP1G07GZYL (935691743315) |
Active | pS |
XSON5 (SOT8065-1) |
SOT8065-1 | SOT8065-1_315 |
环境信息
| 型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74AUP1G07GM | 74AUP1G07GM,115 | 74AUP1G07GM |
|
|
| 74AUP1G07GM | 74AUP1G07GM,132 | 74AUP1G07GM |
|
|
| 74AUP1G07GN | 74AUP1G07GN,132 | 74AUP1G07GN |
|
|
| 74AUP1G07GS | 74AUP1G07GS,132 | 74AUP1G07GS |
|
|
| 74AUP1G07GW | 74AUP1G07GW,125 | 74AUP1G07GW |
|
|
| 74AUP1G07GX | 74AUP1G07GX,125 | 74AUP1G07GX |
|
|
| 74AUP1G07GX4 | 74AUP1G07GX4Z | 74AUP1G07GX4 |
|
|
| 74AUP1G07GZ | 74AUP1G07GZYL | 74AUP1G07GZ |
|
|
文档 (41)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| 74AUP1G07 | Low-power buffer with open-drain output | Data sheet | 2024-08-30 |
| AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
| AN11052 | Pin FMEA for AUP family | Application note | 2019-01-09 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| mna623 | Block diagram: 74AUP1G07GF, 74AUP1G07GM, 74AUP1G07GW, 74LVC1G07GF, 74LVC1G07GM, 74LVC1G07GV, 74LVC1G07GW | Block diagram | 2009-11-04 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
| SOT891 | 3D model for products with SOT891 package | Design support | 2019-10-03 |
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT1115 | 3D model for products with SOT1115 package | Design support | 2023-02-02 |
| SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
| SOT353-1 | 3D model for products with SOT353-1 package | Design support | 2019-09-23 |
| SOT1226-3 | 3D model for products with SOT1226-3 package | Design support | 2021-01-28 |
| SOT1269-2 | 3D model for products with SOT1269-2 package | Design support | 2023-02-02 |
| SOT1269 | 3D model for products with SOT1269 package | Design support | 2019-10-07 |
| SOT8065-1 | 3D model for products with SOT8065-1 package | Design support | 2024-11-05 |
| aup1g07 | 74AUP1G07 IBIS model | IBIS model | 2014-12-14 |
| Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Leaflet | 2019-04-12 |
| Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| Leaflet_SOT8065_Minilogic | Leaflet_SOT8065 Minilogic | Leaflet | 2024-11-15 |
| DFN1010-6_SOT891_mk | plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 1 mm x 1 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| XSON6_SOT1115_mk | plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Marcom graphics | 2017-01-28 |
| TSSOP5_SOT353-1_mk | plastic, thin shrink small outline package; 5 leads; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body | Marcom graphics | 2018-07-25 |
| XSON4_SOT1269-2_mk | plastic, leadless thermal enhanced extremely thin outline package, no leads; 4 terminals; 0.4 mm pitch; 0.6 mm x 0.6 mm x 0.32 mm body | Marcom graphics | 2019-02-04 |
| SOT891 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1 mm x 0.5 mm body | Package information | 2020-04-21 |
| SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
| SOT1115 | plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Package information | 2022-05-27 |
| SOT1202 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body | Package information | 2022-06-01 |
| SOT353-1 | plastic thin shrink small outline package; 5 leads; body width 1.25 mm | Package information | 2022-11-15 |
| SOT1226-3 | plastic thermal enhanced extremely thin small outline package; no leads;5 terminals; body 0.8 x 0.8 x 0.32 mm | Package information | 2020-08-27 |
| SOT1269-2 | plastic, leadless thermal enhanced extremely thin outline package, no leads; 4 terminals; 0.4 mm pitch; 0.6 mm x 0.6 mm x 0.32 mm body | Package information | 2020-08-18 |
| SOT8065-1 | Plastic thermal enhanced extremely thin small outline package withside-wettable flanks (SWF); no leads; 5 terminals; body 1.1 × 0.85 × 0.5mm | Package information | 2024-08-28 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| MAR_SOT891 | MAR_SOT891 Topmark | Top marking | 2013-06-03 |
| MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
| MAR_SOT1115 | MAR_SOT1115 Topmark | Top marking | 2013-06-03 |
| MAR_SOT1202 | MAR_SOT1202 Topmark | Top marking | 2013-06-03 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
支持
如果您需要设计/技术支持，请告知我们并填写 应答表 我们会尽快回复您。
模型
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| SOT891 | 3D model for products with SOT891 package | Design support | 2019-10-03 |
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT1115 | 3D model for products with SOT1115 package | Design support | 2023-02-02 |
| SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
| SOT353-1 | 3D model for products with SOT353-1 package | Design support | 2019-09-23 |
| SOT1226-3 | 3D model for products with SOT1226-3 package | Design support | 2021-01-28 |
| SOT1269-2 | 3D model for products with SOT1269-2 package | Design support | 2023-02-02 |
| SOT1269 | 3D model for products with SOT1269 package | Design support | 2019-10-07 |
| SOT8065-1 | 3D model for products with SOT8065-1 package | Design support | 2024-11-05 |
| aup1g07 | 74AUP1G07 IBIS model | IBIS model | 2014-12-14 |
Ordering, pricing & availability
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