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74AUP1G125

Low-power buffer/line driver; 3-state

The 74AUP1G125 is a single buffer/line driver with 3-state output. Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times. This device ensures very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V.

This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

特性

  • Wide supply voltage range from 0.8 V to 3.6 V

  • High noise immunity

  • Complies with JEDEC standards:

    • JESD8-12 (0.8 V to 1.3 V)

    • JESD8-11 (0.9 V to 1.65 V)

    • JESD8-7 (1.2 V to 1.95 V)

    • JESD8-5 (1.8 V to 2.7 V)

    • JESD8-B (2.7 V to 3.6 V)

  • Low static power consumption; ICC = 0.9 μA (maximum)

  • Latch-up performance exceeds 100 mA per JESD 78 Class II

  • Inputs accept voltages up to 3.6 V

  • Low noise overshoot and undershoot < 10 % of VCC

  • Input-disable feature allows floating input conditions

  • IOFF circuitry provides partial Power-down mode operation

  • Multiple package options

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

参数类型

Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)fmax (MHz)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Rth(j-c) (K/W)Package name
74AUP1G125GMProduction0.8 - 3.6CMOS± 1.9701ultra low-40~125311157XSON6
74AUP1G125GNProduction0.8 - 3.6CMOS± 1.9701ultra low-40~125334207XSON6
74AUP1G125GSProduction0.8 - 3.6CMOS± 1.9701ultra low-40~125321215XSON6
74AUP1G125GWProduction0.8 - 3.6CMOS± 1.9701ultra low-40~125309179TSSOP5
74AUP1G125GXProduction0.8 - 3.6CMOS± 1.9701ultra low-40~125322191X2SON5

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
74AUP1G125GM
XSON6
(SOT886) 		SOT886REFLOW_BG-BD-1
SOT886_132ActivepM74AUP1G125GM,132
( 9352 790 55132 )
SOT886_115ActivepM74AUP1G125GM,115
( 9352 790 55115 )
74AUP1G125GN
XSON6
(SOT1115) 		SOT1115REFLOW_BG-BD-1
SOT1115_132ActivepM74AUP1G125GN,132
( 9352 917 22132 )
74AUP1G125GS
XSON6
(SOT1202) 		SOT1202REFLOW_BG-BD-1
SOT1202_132ActivepM74AUP1G125GS,132
( 9352 928 46132 )
74AUP1G125GW
TSSOP5
(SOT353-1) 		SOT353-1WAVE_BG-BD-1
SOT353-1_125ActivepM74AUP1G125GW,125
( 9352 790 54125 )
74AUP1G125GX
X2SON5
(SOT1226-3) 		SOT1226-3SOT1226-3_125ActivepM74AUP1G125GX,125
( 9352 983 68125 )

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
74AUP1G125GM74AUP1G125GM,13274AUP1G125GMAlways Pb-free
74AUP1G125GM74AUP1G125GM,11574AUP1G125GMAlways Pb-free
74AUP1G125GN74AUP1G125GN,13274AUP1G125GNAlways Pb-free
74AUP1G125GS74AUP1G125GS,13274AUP1G125GSAlways Pb-free
74AUP1G125GW74AUP1G125GW,12574AUP1G125GWAlways Pb-free
74AUP1G125GX74AUP1G125GX,12574AUP1G125GXAlways Pb-free
品质及可靠性免责声明

文档 (19)

文件名称标题类型日期
74AUP1G125Low-power buffer/line driver; 3-stateData sheet2023-07-11
AN10161PicoGate Logic footprintsApplication note2002-10-29
AN11052Pin FMEA for AUP familyApplication note2019-01-09
aup1g12574AUP1G125 IBIS modelIBIS model2014-12-14
Nexperia_document_leaflet_Logic_X2SON_packages_062018X2SON ultra-small 4, 5, 6 & 8-pin leadless packagesLeaflet2018-06-05
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Leaflet2019-04-12
Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1202MAR_SOT1202 TopmarkTop marking2013-06-03
SOT1202plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm bodyPackage information2022-06-01
WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08
SOT353-1plastic thin shrink small outline package; 5 leads; body width 1.25 mmPackage information2022-11-15
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1115MAR_SOT1115 TopmarkTop marking2013-06-03
SOT1115plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm bodyPackage information2022-05-27
MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03
SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2022-06-01
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
SOT1226-3plastic thermal enhanced extremely thin small outline package; no leads;5 terminals; body 0.8 x 0.8 x 0.32 mmPackage information2020-08-27

支持

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模型

文件名称标题类型日期
aup1g12574AUP1G125 IBIS modelIBIS model2014-12-14

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