双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

74LVC2G04

Dual inverter

The 74LVC2G04 is a dual inverter. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V environments.

Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times.

This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.

Features and benefits

  • Wide supply voltage range from 1.65 V to 5.5 V

  • Overvoltage tolerant inputs to 5.5 V

  • High noise immunity

  • ±24 mA output drive (VCC = 3.0 V)

  • CMOS low power dissipation

  • Direct interface with TTL levels

  • IOFF circuitry provides partial Power-down mode operation

  • Latch-up performance exceeds 250 mA

  • Complies with JEDEC standard:

    • JESD8-7 (1.65 V to 1.95 V)

    • JESD8-5 (2.3 V to 2.7 V)

    • JESD8C (2.7 V to 3.6 V)
    • JESD36 (4.6 V to 5.5 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from −40 °C to +85 °C and −40 °C to +125 °C.

参数类型

型号 VCC (V) Logic switching levels Output drive capability (mA) fmax (MHz) Nr of bits Power dissipation considerations Tamb (°C) Rth(j-a) (K/W) Ψth(j-top) (K/W) Rth(j-c) (K/W) Package name
74LVC2G04GM 1.65 - 5.5 CMOS/LVTTL ± 32 175 2 low -40~125 290 7.7 145 XSON6
74LVC2G04GN 1.65 - 5.5 CMOS/LVTTL ± 32 175 2 low -40~125 274 170 XSON6
74LVC2G04GS 1.65 - 5.5 CMOS/LVTTL ± 32 175 2 low -40~125 271 176 XSON6
74LVC2G04GV 1.65 - 5.5 CMOS/LVTTL ± 32 175 2 low -40~125 232 145 TSOP6
74LVC2G04GW 1.65 - 5.5 CMOS/LVTTL ± 32 175 2 low -40~125 264 153 TSSOP6
74LVC2G04GX 1.65 - 5.5 CMOS/LVTTL ± 32 175 2 low -40~125 436 9.3 210 X2SON6

封装

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
74LVC2G04GM 74LVC2G04GM,115
(935277161115)		 Active V4 SOT886
XSON6
(SOT886) 		SOT886 REFLOW_BG-BD-1
SOT886_115
74LVC2G04GM,132
(935277161132)		 Active V4 SOT886_132
74LVC2G04GN 74LVC2G04GN,132
(935291798132)		 Active V4 SOT1115
XSON6
(SOT1115) 		SOT1115 REFLOW_BG-BD-1
SOT1115_132
74LVC2G04GS 74LVC2G04GS,132
(935292926132)		 Active V4 SOT1202
XSON6
(SOT1202) 		SOT1202 REFLOW_BG-BD-1
SOT1202_132
74LVC2G04GV 74LVC2G04GV,125
(935273525125)		 Active V04 SOT457
TSOP6
(SOT457) 		SOT457 REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT457_125
74LVC2G04GW 74LVC2G04GW,125
(935273523125)		 Active V4 SOT363-2
TSSOP6
(SOT363-2) 		SOT363-2 SOT363-2_125
74LVC2G04GX 74LVC2G04GXZ
(935307076147)		 Active V4 SOT1255-2
X2SON6
(SOT1255-2) 		SOT1255-2 SOT1255-2_147

下表中的所有产品型号均已停产 。

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
74LVC2G04GF 74LVC2G04GF,132
(935282429132)		 Withdrawn / End-of-life SOT891
XSON6
(SOT891) 		SOT891 REFLOW_BG-BD-1
SOT891_132

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74LVC2G04GM 74LVC2G04GM,115 74LVC2G04GM rohs rhf rhf
74LVC2G04GM 74LVC2G04GM,132 74LVC2G04GM rohs rhf rhf
74LVC2G04GN 74LVC2G04GN,132 74LVC2G04GN rohs rhf rhf
74LVC2G04GS 74LVC2G04GS,132 74LVC2G04GS rohs rhf rhf
74LVC2G04GV 74LVC2G04GV,125 74LVC2G04GV rohs rhf rhf
74LVC2G04GW 74LVC2G04GW,125 74LVC2G04GW rohs rhf rhf
74LVC2G04GX 74LVC2G04GXZ 74LVC2G04GX rohs rhf rhf

下表中的所有产品型号均已停产 。

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74LVC2G04GF 74LVC2G04GF,132 74LVC2G04GF rohs rhf rhf
品质及可靠性免责声明

文档 (36)

文件名称 标题 类型 日期
74LVC2G04 Dual inverter Data sheet 2023-08-15
AN10161 PicoGate Logic footprints Application note 2002-10-29
AN11009 Pin FMEA for LVC family Application note 2019-01-09
AN90063 Questions about package outline drawings Application note 2025-10-22
mnb079 Block diagram: 74LVC2G04GF, 74LVC2G04GM, 74LVC2G04GV, 74LVC2G04GW, 74AUP2G04GF, 74AUP2G04GM, 74AUP2G04GW, 74HC2G04GV, 74HC2G04GW, 74HC2GU04GV, 74HC2GU04GW, 74HCT2G04GV, 74HCT2G04GW Block diagram 2009-11-04
Nexperia_document_guide_MiniLogic_MicroPak_201808 MicroPak leadless logic portfolio guide Brochure 2018-09-03
Nexperia_document_guide_MiniLogic_PicoGate_201901 PicoGate leaded logic portfolio guide Brochure 2019-01-07
SOT891 3D model for products with SOT891 package Design support 2019-10-03
SOT886 3D model for products with SOT886 package Design support 2019-10-03
SOT1115 3D model for products with SOT1115 package Design support 2023-02-02
SOT1202 3D model for products with SOT1202 package Design support 2023-02-02
SOT457 3D model for products with SOT457 package Design support 2022-11-04
SOT363-2 3D model for products with SOT363-2 package Design support 2023-02-02
SOT1255-2 3D model for products with SOT1255-2 package Design support 2021-01-28
lvc2g04 74LVC2G04 IBIS model IBIS model 2015-09-06
Nexperia_document_leaflet_Logic_X2SON_packages_062018 X2SON ultra-small 4, 5, 6 & 8-pin leadless packages Leaflet 2018-06-05
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DFN1010-6_SOT891_mk plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 1 mm x 1 mm x 0.5 mm body Marcom graphics 2017-01-28
DFN1410-6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
XSON6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
XSON6_SOT1115_mk plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 0.9 mm x 1 mm x 0.35 mm body Marcom graphics 2017-01-28
TSOP6_SOT457_mk plastic, surface-mounted package (TSOP6); 6 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body Marcom graphics 2017-01-28
SOT891 plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1 mm x 0.5 mm body Package information 2020-04-21
SOT886 plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Package information 2022-06-01
SOT1115 plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body Package information 2022-05-27
SOT1202 plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body Package information 2022-06-01
SOT457 plastic, surface-mounted package (SC-74; TSOP6); 6 leads Package information 2023-03-03
SOT363-2 plastic thin shrink small outline package; 6 leads; body width 1.25 mm Package information 2022-11-21
SOT1255-2 plastic thermal enhanced extremely thin small outline package; no leads;6 terminals; body 1.0 x 0.8 x 0.32 mm Package information 2020-08-27
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
MAR_SOT891 MAR_SOT891 Topmark Top marking 2013-06-03
MAR_SOT886 MAR_SOT886 Topmark Top marking 2013-06-03
MAR_SOT1115 MAR_SOT1115 Topmark Top marking 2013-06-03
MAR_SOT1202 MAR_SOT1202 Topmark Top marking 2013-06-03
MAR_SOT457 MAR_SOT457 Topmark Top marking 2013-06-03
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08

支持

如果您需要设计/技术支持，请告知我们并填写 应答表 我们会尽快回复您。

模型

文件名称 标题 类型 日期
SOT891 3D model for products with SOT891 package Design support 2019-10-03
SOT886 3D model for products with SOT886 package Design support 2019-10-03
SOT1115 3D model for products with SOT1115 package Design support 2023-02-02
SOT1202 3D model for products with SOT1202 package Design support 2023-02-02
SOT457 3D model for products with SOT457 package Design support 2022-11-04
SOT363-2 3D model for products with SOT363-2 package Design support 2023-02-02
SOT1255-2 3D model for products with SOT1255-2 package Design support 2021-01-28
lvc2g04 74LVC2G04 IBIS model IBIS model 2015-09-06

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