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74LVC2G241

Dual buffer/line driver; 3-state

The 74LVC2G241 is a dual non-inverting buffer/line driver with 3-state outputs. The 3-state outputs are controlled by the output enable inputs 1OE and 2OE:

  • A HIGH level at pin 1OE causes output 1Y to assume a high-impedance OFF-state.

  • A LOW level at pin 2OE causes output 2Y to assume a high-impedance OFF-state.

Schmitt trigger action at all inputs makes the circuit highly tolerant of slower input rise and fall times.

Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of the 74LVC2G241 as a translator in a mixed 3.3 V and 5 V environment.

This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing a damaging backflow current through the device when it is powered down.

特性

  • Wide supply voltage range from 1.65 V to 5.5 V

  • 5 V tolerant input/output for interfacing with 5 V logic

  • High noise immunity

  • ±24 mA output drive (VCC = 3.0 V)

  • CMOS low power consumption

  • Latch-up performance exceeds 250 mA

  • Direct interface with TTL levels

  • Inputs accept voltages up to 5 V

  • Complies with JEDEC standard:

    • JESD8-7 (1.65 V to 1.95 V)

    • JESD8-5 (2.3 V to 2.7 V)

    • JESD8-B/JESD36 (2.7 V to 3.6 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

参数类型

Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)fmax (MHz)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Rth(j-c) (K/W)Package name
74LVC2G241DCProduction1.65 - 5.5CMOS/LVTTL± 321752low-40~125206117VSSOP8
74LVC2G241DPProduction1.65 - 5.5CMOS/LVTTL± 321752low-40~125220107TSSOP8
74LVC2G241GNProduction1.65 - 5.5CMOS/LVTTL± 321752low-40~125247155XSON8
74LVC2G241GSProduction1.65 - 5.5CMOS/LVTTL± 321752low-40~125284152XSON8
74LVC2G241GTProduction1.65 - 5.5CMOS/LVTTL± 321752low-40~125339166XSON8

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
74LVC2G241DC
VSSOP8
(SOT765-1) 		SOT765-1SOT765-1_125ActiveV4174LVC2G241DC,125
( 9352 745 09125 )
74LVC2G241DP
TSSOP8
(SOT505-2) 		SOT505-2SOT505-2_125ActiveV24174LVC2G241DP,125
( 9352 720 06125 )
74LVC2G241GN
XSON8
(SOT1116) 		SOT1116REFLOW_BG-BD-1
SOT1116_115ActiveV174LVC2G241GN,115
( 9352 922 43115 )
74LVC2G241GS
XSON8
(SOT1203) 		SOT1203REFLOW_BG-BD-1
SOT1203_115ActiveV174LVC2G241GS,115
( 9352 927 98115 )
74LVC2G241GT
XSON8
(SOT833-1) 		SOT833-1SOT833-1_115ActiveV4174LVC2G241GT,115
( 9352 789 26115 )

停产信息

型号可订购的器件编号，（订购码(12NC)）最后一次购买日期最后一次交货日期替代产品状态备注
74LVC2G241DP935272006118

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
74LVC2G241DC74LVC2G241DC,12574LVC2G241DCweek 1, 2005
74LVC2G241DP74LVC2G241DP,12574LVC2G241DPweek 41, 2004
74LVC2G241GN74LVC2G241GN,11574LVC2G241GNAlways Pb-free
74LVC2G241GS74LVC2G241GS,11574LVC2G241GSAlways Pb-free
74LVC2G241GT74LVC2G241GT,11574LVC2G241GTAlways Pb-free
品质及可靠性免责声明

文档 (15)

文件名称标题类型日期
74LVC2G241Dual buffer/line driver; 3-stateData sheet2023-08-21
AN10161PicoGate Logic footprintsApplication note2002-10-29
AN11009Pin FMEA for LVC familyApplication note2019-01-09
lvc2g24174LVC2G241 IBIS modelIBIS model2014-10-20
Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
SOT505-2plastic, thin shrink small outline package; 8 leads; 0.65 mm pitch; 3 mm x 3 mm x 1.1 mm bodyPackage information2022-06-03
MAR_SOT1203MAR_SOT1203 TopmarkTop marking2013-06-03
SOT1203plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm bodyPackage information2022-06-03
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT833MAR_SOT833 TopmarkTop marking2013-06-03
SOT833-1plastic, leadless extremely thin small outline package; 8 terminals; 0.5 mm pitch; 1 mm x 1.95 mm x 0.5 mm bodyPackage information2022-06-03
SOT765-1plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm bodyPackage information2022-06-03
MAR_SOT1116MAR_SOT1116 TopmarkTop marking2013-06-03
SOT1116plastic, leadless extremely thin small outline package; 8 terminals; 0.3 mm pitch; 1.2 mm x 1 mm x 0.35 mm bodyPackage information2022-06-02
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06

支持

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模型

文件名称标题类型日期
lvc2g24174LVC2G241 IBIS modelIBIS model2014-10-20

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