参数类型
| 型号 | Package version | Package name | Size (mm) | channel type (e) | Ptot (mW) | VCEO [max] (V) | IC [max] (mA) | hFE [min] | hFE [max] | TJ [max] (°C) | fT [min] (MHz) | Automotive qualified |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BSP31 | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | PNP | 1300.0 | -60.0 | -1000.0 | 100.0 | 300.0 | 150 | 100.0 | Y |
| BSP33 | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | PNP | 1300.0 | -80.0 | -1000.0 | 100.0 | 300.0 | 150 | 100.0 | Y |
封装
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| BSP31 | BSP31,115 (933981970115) |
Active | BSP31 |
SC-73 (SOT223) |
SOT223 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT223_115 |
| BSP33 | BSP33,115 (933981990115) |
Active | BSP33 |
SC-73 (SOT223) |
SOT223 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT223_115 |
下表中的所有产品型号均已停产 。
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| BSP32 | BSP32,115 (933981980115) |
Discontinued / End-of-life | BSP32 |
SC-73 (SOT223) |
SOT223 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT223_115 |
文档 (9)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| BSP31_32_33 | PNP medium power transistors | Data sheet | 2025-04-08 |
| AN90063 | Questions about package outline drawings | Application note | 2025-03-12 |
| SOT223 | 3D model for products with SOT223 package | Design support | 2019-01-22 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SC-73_SOT223_mk | plastic, surface-mounted package with increased heatsink; 4 leads; 4.6 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body | Marcom graphics | 2017-01-28 |
| LSYMTRA | Letter Symbols - Transistors; General | Other type | 1999-05-06 |
| SOT223 | plastic, surface-mounted package with increased heatsink; 4 leads; 2.3 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body | Package information | 2022-05-30 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
