参数类型
型号 |
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封装
下表中的所有产品型号均已停产 。
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
BSP31 | BSP31,115 (933981970115) |
Discontinued / End-of-life | BSP31 |
![]() SC-73 (SOT223) |
SOT223 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT223_115 |
BSP32 | BSP32,115 (933981980115) |
Discontinued / End-of-life | BSP32 |
![]() SC-73 (SOT223) |
SOT223 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT223_115 |
BSP33 | BSP33,115 (933981990115) |
Discontinued / End-of-life | BSP33 |
![]() SC-73 (SOT223) |
SOT223 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT223_115 |
文档 (9)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
BSP31_32_33 | PNP medium power transistors | Data sheet | 2025-04-08 |
AN90063 | Questions about package outline drawings | Application note | 2025-06-13 |
SOT223 | 3D model for products with SOT223 package | Design support | 2019-01-22 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
SC-73_SOT223_mk | plastic, surface-mounted package with increased heatsink; 4 leads; 4.6 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body | Marcom graphics | 2017-01-28 |
LSYMTRA | Letter Symbols - Transistors; General | Other type | 1999-05-06 |
SOT223 | plastic, surface-mounted package with increased heatsink; 4 leads; 2.3 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body | Package information | 2022-05-30 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |