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74LVC1G16

Single buffer

The 74LVC1G16 provides a low-power, low-voltage single buffer.

The input can be driven from either 3.3 V or 5 V devices. This feature allows the use of this device in a mixed 3.3 V and 5 V environment.

This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.

Schmitt trigger action at all inputs makes the circuit highly tolerant of slower input rise and fall times.

特性

  • Wide supply voltage range from 1.65 V to 5.5 V

  • 5 V tolerant inputs for interfacing with 5 V logic

  • High noise immunity

  • ±24 mA output drive (VCC = 3.0 V)

  • CMOS low power consumption

  • Latch-up performance exceeds 250 mA

  • Direct interface with TTL levels

  • Inputs accept voltages up to 5 V

  • Complies with JEDEC standard:

    • JESD8-7 (1.65 V to 1.95 V)

    • JESD8-5 (2.3 V to 2.7 V)

    • JESD8-B/JESD36 (2.7 V to 3.6 V).

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

参数类型

Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)fmax (MHz)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Rth(j-c) (K/W)Package name
74LVC1G16GMProduction1.65 - 5.5CMOS/LVTTL± 321751low-40~125320163XSON6
74LVC1G16GWProduction1.65 - 5.5CMOS/LVTTL± 321751low-40~125319188TSSOP5

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
74LVC1G16GM
XSON6
(SOT886) 		SOT886REFLOW_BG-BD-1
SOT886_125ActiveYr74LVC1G16GMH
( 9353 075 88125 )
74LVC1G16GW
TSSOP5
(SOT353-1) 		SOT353-1WAVE_BG-BD-1
SOT353-1_125ActiveYr74LVC1G16GWH
( 9353 075 91125 )

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
74LVC1G16GM74LVC1G16GMH74LVC1G16GMAlways Pb-free
74LVC1G16GW74LVC1G16GWH74LVC1G16GWAlways Pb-free
品质及可靠性免责声明

文档 (8)

文件名称标题类型日期
74LVC1G16Single bufferData sheet2023-08-15
lvc1g1674LVC1G16 IBIS modelIBIS model2015-10-29
Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08
SOT353-1plastic thin shrink small outline package; 5 leads; body width 1.25 mmPackage information2022-11-15
MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03
SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2022-06-01
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06

支持

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模型

文件名称标题类型日期
lvc1g1674LVC1G16 IBIS modelIBIS model2015-10-29

订购、定价与供货

样品

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样品订单通常需要2-4天寄送时间。

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