双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

74AUP1G16

Low-power buffer

The 74AUP1G16 provides a low-power, low-voltage single buffer.

Schmitt trigger action at all inputs makes the circuit tolerant to slower input rise and fall times across the entire VCC range from 0.8 V to 3.6 V.

This device ensures a very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V.

This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.

Features and benefits

  • Wide supply voltage range from 0.8 V to 3.6 V

  • High noise immunity

  • Complies with JEDEC standards:

    • JESD8-12 (0.8 V to 1.3 V)

    • JESD8-11 (0.9 V to 1.65 V)

    • JESD8-7 (1.2 V to 1.95 V)

    • JESD8-5 (1.8 V to 2.7 V)

    • JESD8-B (2.7 V to 3.6 V)

  • Low static power consumption; ICC = 0.9 μA (maximum)

  • Latch-up performance exceeds 100 mA per JESD 78 Class II

  • Inputs accept voltages up to 3.6 V

  • Low noise overshoot and undershoot < 10 % of VCC

  • IOFF circuitry provides partial power-down mode operation

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

参数类型

型号 VCC (V) Logic switching levels Output drive capability (mA) fmax (MHz) Nr of bits Power dissipation considerations Tamb (°C) Rth(j-a) (K/W) Ψth(j-top) (K/W) Rth(j-c) (K/W) Package name
74AUP1G16GM 0.8 - 3.6 CMOS ± 1.9 70 1 ultra low -40~125 311 7 157 XSON6
74AUP1G16GW 0.8 - 3.6 CMOS ± 1.9 70 1 ultra low -40~125 309 79.2 179 TSSOP5

封装

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
74AUP1G16GM 74AUP1G16GMH
(935307535125)		 Active 5N SOT886
XSON6
(SOT886) 		SOT886 SOT886_125
74AUP1G16GW 74AUP1G16GWH
(935307534125)		 Active 5N SOT353-1
TSSOP5
(SOT353-1) 		SOT353-1 WAVE_BG-BD-1
SOT353-1_125

下表中的所有产品型号均已停产 。

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
74AUP1G16GF 74AUP1G16GFH
(935307536125)		 Obsolete 5N SOT891
XSON6
(SOT891) 		SOT891 暂无信息

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74AUP1G16GM 74AUP1G16GMH 74AUP1G16GM rohs rhf rhf
74AUP1G16GW 74AUP1G16GWH 74AUP1G16GW rohs rhf rhf

下表中的所有产品型号均已停产 。

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74AUP1G16GF 74AUP1G16GFH 74AUP1G16GF rohs rhf rhf
品质及可靠性免责声明

文档 (20)

文件名称 标题 类型 日期
74AUP1G16 Low-power buffer Data sheet 2023-07-17
AN90063 Questions about package outline drawings Application note 2025-10-22
Nexperia_document_guide_MiniLogic_MicroPak_201808 MicroPak leadless logic portfolio guide Brochure 2018-09-03
Nexperia_document_guide_MiniLogic_PicoGate_201901 PicoGate leaded logic portfolio guide Brochure 2019-01-07
SOT891 3D model for products with SOT891 package Design support 2019-10-03
SOT886 3D model for products with SOT886 package Design support 2019-10-03
SOT353-1 3D model for products with SOT353-1 package Design support 2019-09-23
aup1g16 74AUP1G16 IBIS model IBIS model 2015-10-30
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 Leaflet 2019-04-12
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DFN1010-6_SOT891_mk plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 1 mm x 1 mm x 0.5 mm body Marcom graphics 2017-01-28
DFN1410-6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
XSON6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
TSSOP5_SOT353-1_mk plastic, thin shrink small outline package; 5 leads; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body Marcom graphics 2018-07-25
SOT891 plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1 mm x 0.5 mm body Package information 2020-04-21
SOT886 plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Package information 2022-06-01
SOT353-1 plastic thin shrink small outline package; 5 leads; body width 1.25 mm Package information 2022-11-15
MAR_SOT891 MAR_SOT891 Topmark Top marking 2013-06-03
MAR_SOT886 MAR_SOT886 Topmark Top marking 2013-06-03
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08

支持

如果您需要设计/技术支持，请告知我们并填写 应答表 我们会尽快回复您。

模型

文件名称 标题 类型 日期
SOT891 3D model for products with SOT891 package Design support 2019-10-03
SOT886 3D model for products with SOT886 package Design support 2019-10-03
SOT353-1 3D model for products with SOT353-1 package Design support 2019-09-23
aup1g16 74AUP1G16 IBIS model IBIS model 2015-10-30

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