 
74LV541AT
Octal buffer/line driver; 3-state
The 74LV541AT is an 8-bit buffer/line driver with 3-state outputs and TTL inputs. The device features two output enables (OE1 and OE2). A HIGH on OEn causes the associated outputs to assume a high-impedance OFF-state.
Designed to operate over a VCC range from 4.5 V to 5.5 V, the inputs are TTL compatible, which allows the device to be used to translate from 3.3 V to 5 V.
Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times.
This device is fully specified for partial Power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.
Features and benefits
- Direct interface with TTL levels 
- Supply voltage range from 4.5 V to 5.5 V 
- Typical tpd of 2.8 ns at 5 V 
- Typical VOL(p) < 0.8 V at VCC = 5 V, Tamb = 25 °C 
- Typical VOH(v) > 2.3 V at VCC = 5 V, Tamb = 25 °C 
- Supports mixed-mode voltage operation on all ports 
- IOFF circuitry provides partial Power-down mode operation 
- Latch-up performance exceeds 250 mA per JESD 78 Class II 
- ESD protection:
- HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 3000 V 
- CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 2000 V 
 
- Specified from -40 °C to +85 °C and from -40 °C to +125 °C 
参数类型
| 型号 | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name | 
|---|---|---|---|---|---|---|---|---|---|---|---|
| 74LV541ATPW | 4.5 - 5.5 | TTL | ± 16 | 60 | 8 | low | -40~125 | 101 | 4.7 | 45 | TSSOP20 | 
封装
| 型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 | 
|---|---|---|---|---|---|---|---|
| 74LV541ATPW | 74LV541ATPWJ (935306646118) | Active | LV541AT |   TSSOP20 (SOT360-1) | SOT360-1 | SSOP-TSSOP-VSO-WAVE | SOT360-1_118 | 
文档 (9)
| 文件名称 | 标题 | 类型 | 日期 | 
|---|---|---|---|
| 74LV541AT | Octal buffer/line driver; 3-state | Data sheet | 2024-07-04 | 
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 | 
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 | 
| lv541at | 74LV541AT IBIS model | IBIS model | 2016-03-18 | 
| Nexperia_document_leaflet_Logic_LV-AT_201903 | LV-A(T) logic family | Leaflet | 2019-03-19 | 
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 | 
| TSSOP20_SOT360-1_mk | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 | 
| SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body | Package information | 2024-11-15 | 
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 | 
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