Nexperia
Or cross multiple parts
×

BC56xPAS series

80 V, 1 A NPN medium power transistors

NPN medium power transistor series encapsulated in an ultra thin DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic package with medium power capability and visible and solderable side pads.

特性

  • High collector current capability IC and ICM

  • Reduced Printed-Circuit Board (PCB) area requirements

  • Exposed heat sink for excellent thermal and electrical conductivity

  • Two current gain selections

  • Leadless very small SMD plastic package with medium power capability

  • Suitable for Automatic Optical Inspection (AOI) of solder joint

  • AEC-Q101 qualified

目标应用

  • Linear voltage regulators

  • Battery driven devices

  • MOSFET drivers

  • High-side switches

  • Power management

  • Amplifiers

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
BC56-10PAS
DFN2020D-3
(SOT1061D) 		SOT1061DREFLOW_BG-BD-1
SOT1061D_115ActiveCLBC56-10PASX
( 9340 681 32115 )
BC56-16PAS
DFN2020D-3
(SOT1061D) 		SOT1061DREFLOW_BG-BD-1
SOT1061D_115ActiveCMBC56-16PASX
( 9340 681 33115 )
BC56PAS
DFN2020D-3
(SOT1061D) 		SOT1061DREFLOW_BG-BD-1
SOT1061D_115ActiveCKBC56PASX
( 9340 681 31115 )

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
BC56-10PASBC56-10PASXBC56-10PASAlways Pb-free
BC56-16PASBC56-16PASXBC56-16PASAlways Pb-free
BC56PASBC56PASXBC56PASAlways Pb-free
品质及可靠性免责声明

文档 (3)

文件名称标题类型日期
BC56XPAS_SER80 V, 1 A NPN medium power transistorsData sheet2023-05-02
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
SOT1061Dplastic, leadless thermal enhanced ultra thin small outline package with side-wettable flanks (SWF); no leads; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm bodyPackage information2022-10-10

支持

如果您需要设计/技术支持，请告知我们并填写 应答表, 我们会尽快回复您。

订购、定价与供货

    样品

    安世半导体客户可通过我们的销售机构或直接通过在线样品商店订购样品： https://extranet.nexperia.com.

    样品订单通常需要2-4天寄送时间。

    如果您尚未取得安世半导体的直接采购帐号，我们的全球与区域经销网络可以协助您取得样品。