双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

74LVC132A-Q100

Quad 2-input NAND Schmitt trigger

The 74LVC132A-Q100 provides four 2-input NAND gates with Schmitt trigger inputs. It can transform slowly changing input signals into sharply defined, jitter-free output signals.

The inputs switch at different points for positive and negative-going signals. The difference between the positive voltage VT+ and the negative voltage VT- is defined as the input hysteresis voltage VH.

Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V environment.

This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.

Features and benefits

  • Automotive product qualification in accordance with AEC-Q100 (Grade 1)

    • Specified from -40 °C to +85 °C and from -40 °C to +125 °C

  • Wide supply voltage range from 1.2 V to 3.6 V

  • 5 V tolerant inputs for interfacing with 5 V logic

  • CMOS low-power consumption

  • Direct interface with TTL levels

  • Unlimited input rise and fall times

  • Inputs accept voltages up to 5.5 V

  • Complies with JEDEC standard JESD8-C/JESD36 (2.7 V to 3.6 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints

Applications

  • Wave and pulse shapers for highly noisy environments

  • Astable multivibrator

  • Monostable multivibrator.

参数类型

型号 VCC (V) Logic switching levels Output drive capability (mA) tpd (ns) fmax (MHz) Nr of bits Power dissipation considerations Tamb (°C) Rth(j-a) (K/W) Ψth(j-top) (K/W) Rth(j-c) (K/W) Package name
74LVC132ABQ-Q100 1.2 - 3.6 CMOS/LVTTL ± 24 3.4 175 4 low -40~125 108 22.6 76 DHVQFN14
74LVC132AD-Q100 1.2 - 3.6 CMOS/LVTTL ± 24 3.4 175 4 low -40~125 111 21.9 69 SO14
74LVC132APW-Q100 1.2 - 3.6 CMOS/LVTTL ± 24 3.4 175 4 low -40~125 143 8.4 69 TSSOP14

封装

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
74LVC132ABQ-Q100 74LVC132ABQ-Q100X
(935301108115)		 Active C132A SOT762-1
DHVQFN14
(SOT762-1) 		SOT762-1 SOT762-1_115
74LVC132AD-Q100 74LVC132AD-Q100J
(935301106118)		 Active 74LVC132AD SOT108-1
SO14
(SOT108-1) 		SOT108-1 SO-SOJ-REFLOW
SO-SOJ-WAVE
WAVE_BG-BD-1
SOT108-1_118
74LVC132APW-Q100 74LVC132APW-Q100J
(935301107118)		 Active LVC132A SOT402-1
TSSOP14
(SOT402-1) 		SOT402-1 SSOP-TSSOP-VSO-WAVE
SOT402-1_118

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74LVC132ABQ-Q100 74LVC132ABQ-Q100X 74LVC132ABQ-Q100 rohs rhf rhf
74LVC132AD-Q100 74LVC132AD-Q100J 74LVC132AD-Q100 rohs rhf rhf
74LVC132APW-Q100 74LVC132APW-Q100J 74LVC132APW-Q100 rohs rhf rhf
品质及可靠性免责声明

文档 (17)

文件名称 标题 类型 日期
74LVC132A_Q100 Quad 2-input NAND Schmitt trigger Data sheet 2024-02-12
AN90063 Questions about package outline drawings Application note 2025-10-22
SOT762-1 3D model for products with SOT762-1 package Design support 2019-10-03
SOT108-1 3D model for products with SOT108-1 package Design support 2020-01-22
SOT402-1 3D model for products with SOT402-1 package Design support 2023-02-02
lvc132a lvc132a IBIS model IBIS model 2018-11-28
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DHVQFN14_SOT762-1_mk plastic, dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; 0.5 mm pitch; 2.5 mm x 3 mm x 0.85 mm body Marcom graphics 2017-01-28
SO14_SOT108-1_mk plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body Marcom graphics 2017-01-28
TSSOP14_SOT402-1_mk plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body Marcom graphics 2017-01-28
SOT762-1 plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body Package information 2023-04-05
SOT108-1 plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body Package information 2023-11-07
SOT402-1 plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body Package information 2023-11-07
SO-SOJ-REFLOW Footprint for reflow soldering Reflow soldering 2009-10-08
SO-SOJ-WAVE Footprint for wave soldering Wave soldering 2009-10-08
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08
SSOP-TSSOP-VSO-WAVE Footprint for wave soldering Wave soldering 2009-10-08

支持

如果您需要设计/技术支持，请告知我们并填写 应答表 我们会尽快回复您。

模型

文件名称 标题 类型 日期
SOT762-1 3D model for products with SOT762-1 package Design support 2019-10-03
SOT108-1 3D model for products with SOT108-1 package Design support 2020-01-22
SOT402-1 3D model for products with SOT402-1 package Design support 2023-02-02
lvc132a lvc132a IBIS model IBIS model 2018-11-28

Ordering, pricing & availability

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