双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

74AHC541-Q100; 74AHCT541-Q100

Octal buffer/line driver; 3-state

The 74AHC541-Q100; 74AHCT541-Q100 is an 8-bit buffer/line driver with 3-state outputs. The device features two output enables (OE1 and OE2). A HIGH on OEn causes the associated outputs to assume a high-impedance OFF-state. Inputs are overvoltage tolerant. This feature allows the use of these devices as translators in mixed voltage environments.

This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.

Features and benefits

  • Automotive product qualification in accordance with AEC-Q100 (Grade 1)

    • Specified from -40 °C to +85 °C and from -40 °C to +125 °C

  • Wide supply voltage range from 2.0 to 5.5 V

  • Balanced propagation delays

  • High noise immunity

  • All inputs have a Schmitt-trigger action

  • Overvoltage tolerant inputs to 5.5 V

  • CMOS low power dissipation

  • Input levels:

    • For 74AHC541: CMOS level

    • For 74AHCT541: TTL level

  • Latch-up performance exceeds 100 mA per JESD 78 Class II Level A

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints

参数类型

型号 VCC (V) Logic switching levels Output drive capability (mA) fmax (MHz) Nr of bits Power dissipation considerations Tamb (°C) Rth(j-a) (K/W) Ψth(j-top) (K/W) Rth(j-c) (K/W) Package name
74AHC541BQ-Q100 2.0 - 5.5 CMOS ± 8 60 8 low -40~125 78 9.2 50 DHVQFN20
74AHC541D-Q100 2.0 - 5.5 CMOS ± 8 60 8 low -40~125 85 27.4 61 SO20
74AHC541PW-Q100 2.0 - 5.5 CMOS ± 8 60 8 low -40~125 100 4.6 44.7 TSSOP20
74AHCT541BQ-Q100 4.5 - 5.5 TTL ± 8 60 8 low -40~125 78 9.2 50 DHVQFN20
74AHCT541D-Q100 4.5 - 5.5 TTL ± 8 60 8 low -40~125 85 27.4 61 SO20
74AHCT541PW-Q100 4.5 - 5.5 TTL ± 8 60 8 low -40~125 100 4.6 44.7 TSSOP20

封装

型号 可订购的器件编号,(订购码(12NC)) 状态 标示 封装 外形图 回流焊/波峰焊 包装
74AHC541BQ-Q100 74AHC541BQ-Q100X
(935300707115)
Active AHC541 SOT764-1
DHVQFN20
(SOT764-1)
SOT764-1 SOT764-1_115
74AHC541D-Q100 74AHC541D-Q100J
(935300705118)
Active 74AHC541D SOT163-1
SO20
(SOT163-1)
SOT163-1 WAVE_BG-BD-1
SOT163-1_118
74AHC541PW-Q100 74AHC541PW-Q100J
(935300706118)
Active AHC541 SOT360-1
TSSOP20
(SOT360-1)
SOT360-1 SSOP-TSSOP-VSO-WAVE
SOT360-1_118
74AHCT541BQ-Q100 74AHCT541BQ-Q100X
(935300711115)
Active AHCT541 SOT764-1
DHVQFN20
(SOT764-1)
SOT764-1 SOT764-1_115
74AHCT541D-Q100 74AHCT541D-Q100J
(935300708118)
Active 74AHCT541D SOT163-1
SO20
(SOT163-1)
SOT163-1 WAVE_BG-BD-1
SOT163-1_118
74AHCT541PW-Q100 74AHCT541PW-Q100J
(935300709118)
Active AHCT541 SOT360-1
TSSOP20
(SOT360-1)
SOT360-1 SSOP-TSSOP-VSO-WAVE
SOT360-1_118

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74AHC541BQ-Q100 74AHC541BQ-Q100X 74AHC541BQ-Q100 rohs rhf rhf
74AHC541D-Q100 74AHC541D-Q100J 74AHC541D-Q100 rohs rhf rhf
74AHC541PW-Q100 74AHC541PW-Q100J 74AHC541PW-Q100 rohs rhf rhf
74AHCT541BQ-Q100 74AHCT541BQ-Q100X 74AHCT541BQ-Q100 rohs rhf rhf
74AHCT541D-Q100 74AHCT541D-Q100J 74AHCT541D-Q100 rohs rhf rhf
74AHCT541PW-Q100 74AHCT541PW-Q100J 74AHCT541PW-Q100 rohs rhf rhf
品质及可靠性免责声明

文档 (15)

文件名称 标题 类型 日期
74AHC_AHCT541_Q100 Octal buffer/line driver; 3-state Data sheet 2023-09-06
AN90063 Questions about package outline drawings Application note 2025-06-13
SOT764-1 3D model for products with SOT764-1 package Design support 2019-10-03
SOT163-1 3D model for products with SOT163-1 package Design support 2020-01-22
SOT360-1 3D model for products with SOT360-1 package Design support 2020-01-22
ahc541 ahc541 IBIS model IBIS model 2013-04-08
ahct541 ahct541 IBIS model IBIS model 2013-04-08
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DHVQFN20_SOT764-1_mk plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body Marcom graphics 2017-01-28
TSSOP20_SOT360-1_mk plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body Marcom graphics 2017-01-28
SOT764-1 plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body Package information 2022-06-21
SOT163-1 plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm body Package information 2024-11-15
SOT360-1 plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body Package information 2024-11-15
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08
SSOP-TSSOP-VSO-WAVE Footprint for wave soldering Wave soldering 2009-10-08

支持

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模型

文件名称 标题 类型 日期
SOT764-1 3D model for products with SOT764-1 package Design support 2019-10-03
SOT163-1 3D model for products with SOT163-1 package Design support 2020-01-22
SOT360-1 3D model for products with SOT360-1 package Design support 2020-01-22
ahc541 ahc541 IBIS model IBIS model 2013-04-08
ahct541 ahct541 IBIS model IBIS model 2013-04-08

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