双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

74LVC273-Q100

Octal D-type flip-flop with reset; positive-edge trigger

The 74LVC273-Q100 is an octal positive-edge triggered D-type flip-flop. The device features clock (CP) and master reset (MR) inputs. The outputs Qn will assume the state of their corresponding D inputs that meet the set-up and hold time requirements on the LOW-to-HIGH clock (CP) transition. A LOW on MR forces the outputs LOW independently of clock and data inputs. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V environments.

Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times.

This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.

Features and benefits

  • Automotive product qualification in accordance with AEC-Q100 (Grade 1)

    • Specified from -40 °C to +85 °C and from -40 °C to +125 °C

  • Wide supply voltage range from 1.2 V to 3.6 V

  • Overvoltage tolerant inputs to 5.5 V

  • CMOS low power consumption

  • Direct interface with TTL levels

  • Output drive capability 50 Ω transmission lines at +85 °C

  • Complies with JEDEC standard:

    • JESD8-7A (1.65 V to 1.95 V)

    • JESD8-5A (2.3 V to 2.7 V)

    • JESD8-C/JESD36 (2.7 V to 3.6 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints

参数类型

型号 VCC (V) Logic switching levels Output drive capability (mA) tpd (ns) fmax (MHz) Power dissipation considerations Tamb (°C) Rth(j-a) (K/W) Ψth(j-top) (K/W) Rth(j-c) (K/W) Package name
74LVC273BQ-Q100 1.2 - 3.6 CMOS/LVTTL ± 24 6 230 low -40~125 79 9.6 50 DHVQFN20
74LVC273D-Q100 1.2 - 3.6 CMOS/LVTTL ± 24 6 230 low -40~125 85 27.7 61 SO20
74LVC273PW-Q100 1.2 - 3.6 CMOS/LVTTL ± 24 6 230 low -40~125 101 4.7 45 TSSOP20

封装

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
74LVC273BQ-Q100 74LVC273BQ-Q100X
(935302459115)		 Active LVC273 SOT764-1
DHVQFN20
(SOT764-1) 		SOT764-1 SOT764-1_115
74LVC273D-Q100 74LVC273D-Q100J
(935302461118)		 Active 74LVC273D SOT163-1
SO20
(SOT163-1) 		SOT163-1 WAVE_BG-BD-1
SOT163-1_118
74LVC273PW-Q100 74LVC273PW-Q100J
(935302462118)		 Active LVC273 SOT360-1
TSSOP20
(SOT360-1) 		SOT360-1 SSOP-TSSOP-VSO-WAVE
SOT360-1_118

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74LVC273BQ-Q100 74LVC273BQ-Q100X 74LVC273BQ-Q100 rohs rhf rhf
74LVC273D-Q100 74LVC273D-Q100J 74LVC273D-Q100 rohs rhf rhf
74LVC273PW-Q100 74LVC273PW-Q100J 74LVC273PW-Q100 rohs rhf rhf
品质及可靠性免责声明

文档 (17)

文件名称 标题 类型 日期
74LVC273_Q100 Octal D-type flip-flop with reset; positive-edge trigger Data sheet 2023-08-25
AN11009 Pin FMEA for LVC family Application note 2019-01-09
AN263 Power considerations when using CMOS and BiCMOS logic devices Application note 2023-02-07
AN90063 Questions about package outline drawings Application note 2025-06-13
SOT764-1 3D model for products with SOT764-1 package Design support 2019-10-03
SOT163-1 3D model for products with SOT163-1 package Design support 2020-01-22
SOT360-1 3D model for products with SOT360-1 package Design support 2020-01-22
lvc273 lvc273 IBIS model IBIS model 2013-04-08
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DHVQFN20_SOT764-1_mk plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body Marcom graphics 2017-01-28
TSSOP20_SOT360-1_mk plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body Marcom graphics 2017-01-28
SOT764-1 plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body Package information 2022-06-21
SOT163-1 plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm body Package information 2024-11-15
SOT360-1 plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body Package information 2024-11-15
lvc lvc Spice model SPICE model 2013-05-07
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08
SSOP-TSSOP-VSO-WAVE Footprint for wave soldering Wave soldering 2009-10-08

支持

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模型

文件名称 标题 类型 日期
SOT764-1 3D model for products with SOT764-1 package Design support 2019-10-03
SOT163-1 3D model for products with SOT163-1 package Design support 2020-01-22
SOT360-1 3D model for products with SOT360-1 package Design support 2020-01-22
lvc273 lvc273 IBIS model IBIS model 2013-04-08
lvc lvc Spice model SPICE model 2013-05-07

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