双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

74LVC2GU04-Q100

Dual unbuffered inverter

The 74LVC2GU04-Q100 is a dual unbuffered inverter. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V environments.

This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.

Features and benefits

  • Automotive product qualification in accordance with AEC-Q100 (Grade 1)

    • Specified from -40 °C to +85 °C and from -40 °C to +125 °C

  • Wide supply voltage range from 1.65 V to 5.5 V

  • Overvoltage tolerant inputs to 5.5 V

  • High noise immunity

  • ±24 mA output drive (VCC = 3.0 V)

  • CMOS low power dissipation

  • Latch-up performance exceeds 250 mA

  • Complies with JEDEC standard no. 8-1A

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

参数类型

型号 VCC (V) Logic switching levels Output drive capability (mA) fmax (MHz) Nr of bits Power dissipation considerations Tamb (°C) Rth(j-a) (K/W) Ψth(j-top) (K/W) Rth(j-c) (K/W) Package name
74LVC2GU04GM-Q100 1.65 - 5.5 CMOS/LVTTL ± 32 175 2 low -40~125 290 6.5 145 XSON6
74LVC2GU04GV-Q100 1.65 - 5.5 CMOS/LVTTL ± 32 175 2 low -40~125 231 39.1 145 TSOP6
74LVC2GU04GW-Q100 1.65 - 5.5 CMOS/LVTTL ± 32 175 2 low -40~125 264 38.4 153 TSSOP6

封装

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
74LVC2GU04GM-Q100 74LVC2GU04GM-Q100,
(935299056125)		 Active YD SOT886
XSON6
(SOT886) 		SOT886 REFLOW_BG-BD-1
SOT886_125
74LVC2GU04GV-Q100 74LVC2GU04GV-Q100,
(935299057125)		 Active VU4 SOT457
TSOP6
(SOT457) 		SOT457 REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT457_125
74LVC2GU04GW-Q100 74LVC2GU04GW-Q100,
(935299058125)		 Active YD SOT363-2
TSSOP6
(SOT363-2) 		SOT363-2 SOT363-2_125

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74LVC2GU04GM-Q100 74LVC2GU04GM-Q100, 74LVC2GU04GM-Q100 rohs rhf rhf
74LVC2GU04GV-Q100 74LVC2GU04GV-Q100, 74LVC2GU04GV-Q100 rohs rhf rhf
74LVC2GU04GW-Q100 74LVC2GU04GW-Q100, 74LVC2GU04GW-Q100 rohs rhf rhf
品质及可靠性免责声明

文档 (21)

文件名称 标题 类型 日期
74LVC2GU04_Q100 Dual unbuffered inverter Data sheet 2023-08-25
AN10161 PicoGate Logic footprints Application note 2002-10-29
AN11009 Pin FMEA for LVC family Application note 2019-01-09
AN90063 Questions about package outline drawings Application note 2025-10-22
Nexperia_document_guide_MiniLogic_MicroPak_201808 MicroPak leadless logic portfolio guide Brochure 2018-09-03
Nexperia_document_guide_MiniLogic_PicoGate_201901 PicoGate leaded logic portfolio guide Brochure 2019-01-07
SOT886 3D model for products with SOT886 package Design support 2019-10-03
SOT457 3D model for products with SOT457 package Design support 2022-11-04
SOT363-2 3D model for products with SOT363-2 package Design support 2023-02-02
lvc2gu04 74LVC2GU04 IBIS model IBIS model 2014-10-20
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DFN1410-6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
XSON6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
TSOP6_SOT457_mk plastic, surface-mounted package (TSOP6); 6 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body Marcom graphics 2017-01-28
SOT886 plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Package information 2022-06-01
SOT457 plastic, surface-mounted package (SC-74; TSOP6); 6 leads Package information 2023-03-03
SOT363-2 plastic thin shrink small outline package; 6 leads; body width 1.25 mm Package information 2022-11-21
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
MAR_SOT886 MAR_SOT886 Topmark Top marking 2013-06-03
MAR_SOT457 MAR_SOT457 Topmark Top marking 2013-06-03
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08

支持

如果您需要设计/技术支持，请告知我们并填写 应答表 我们会尽快回复您。

模型

文件名称 标题 类型 日期
SOT886 3D model for products with SOT886 package Design support 2019-10-03
SOT457 3D model for products with SOT457 package Design support 2022-11-04
SOT363-2 3D model for products with SOT363-2 package Design support 2023-02-02
lvc2gu04 74LVC2GU04 IBIS model IBIS model 2014-10-20

Ordering, pricing & availability

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