外形图
| 封装版本 | 封装名称 | 封装说明 | 参考 | 发行日期 | 
|---|---|---|---|---|
| OL-PMCM4401VNE | WLCSP4 | wafer level chip-size package; 4 bumps (2 x 2); 0.4 mm pitch; 0.8 mm x 0.8 mm x 0.15 mm body | 2015-07-07 | 
相关文档
| 文件名称 | 标题 | 类型 | 日期 | 
|---|---|---|---|
| OL-PMCM4401VNE | 3D model for products with OL-PMCM4401VNE package | Design support | 2023-03-13 | 
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 | 
| OL-PMCM4401VNE | wafer level chip-size package; 4 bumps (2 x 2); 0.4 mm pitch; 0.8 mm x 0.8 mm x 0.15 mm body | Package information | 2022-07-13 | 
| pmcm4401vne-ssmos_fr | pmcm4401vne-ssmos_fr | Reflow soldering | 2015-07-10 | 
采用此封装的产品
MOSFETs
| 型号 | 描述 | 快速访问 | 
|---|---|---|
| PMCM4401VNE | 12V, N-channel Trench MOSFET | 
