SOT371-1

plastic, shrink small outline package; 56 leads; 0.635 mm pitch; 18.45 mm x 7.5 mm x 2.8 mm body

封装版本	封装名称	封装说明	参考	发行日期
SOT371-1	SSOP56	plastic, shrink small outline package; 56 leads; 0.635 mm pitch; 18.45 mm x 7.5 mm x 2.8 mm body	MO-118 (JEDEC)	2003-02-18

文件名称	标题	类型	日期
Nexperia_package_poster	Nexperia package poster	Leaflet	2020-05-15
SOT371-1	plastic, shrink small outline package; 56 leads; 0.635 mm pitch; 18.45 mm x 7.5 mm x 2.8 mm body	Package information	2020-04-21
SSOP-TSSOP-VSO-REFLOW	Footprint for reflow soldering	Reflow soldering	2009-10-08
SSOP-TSSOP-VSO-WAVE	Footprint for wave soldering	Wave soldering	2009-10-08

型号	描述	快速访问