外形图
| 封装版本 | 封装名称 | 封装说明 | 参考 | 发行日期 |
|---|---|---|---|---|
| SOT8067-1 | HWSON8 | plastic thermal enhanced very very thin Small Outline packages, no leads; 8 terminals; 0.5 mm pitch; 2.0 mm x 2.0 mm x 0.75 mm body | MO-229 (JEDEC) | 2023-08-21 |
相关文档
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| AN90063 | Questions about package outline drawings | Application note | 2025-06-13 |
| SOT8067-1 | plastic thermal enhanced very very thin Small Outline packages, no leads; 8 terminals;0.5 mm pitch; 2.0 mm x 2.0 mm x 0.75 mm body | Package information | 2025-06-10 |
| SOT8067-1_147 | HWSON8; Reel pack for SMD, 7"; Q2/T3 product orientation | Packing information | 2024-02-01 |
采用此封装的产品
Analog & Logic ICs
| 型号 | 描述 | 快速访问 |
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