外形图
封装版本 | 封装名称 | 封装说明 | 参考 | 发行日期 |
---|---|---|---|---|
SOT8080-1 | HVQFN28 | plastic, leadless thermal enhanced very thin quad flat package; 28 terminals; 0.4 mm pitch; 4 mm x 4 mm x 0.85 mm body | MO-220 (JEDEC) | 2023-09-12 |
plastic, leadless thermal enhanced very thin quad flat package; 28 terminals; 0.4 mm pitch; 4 mm x 4 mm x 0.85 mm body
封装版本 | 封装名称 | 封装说明 | 参考 | 发行日期 |
---|---|---|---|---|
SOT8080-1 | HVQFN28 | plastic, leadless thermal enhanced very thin quad flat package; 28 terminals; 0.4 mm pitch; 4 mm x 4 mm x 0.85 mm body | MO-220 (JEDEC) | 2023-09-12 |