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OL-IP3319CX6

OL-IP3319CX6

Wafer level chip-size package; 6 bumps (2 x 3); 0.4 mm pitch; 0.95 mm x 1.34 mm x 0.6 mm body

外形图

封装版本 封装名称 封装说明 参考 发行日期
OL-IP3319CX6 WLCSP6 Wafer level chip-size package; 6 bumps (2 x 3); 0.4 mm pitch; 0.95 mm x 1.34 mm x 0.6 mm body 2013-06-11

相关文档

文件名称 标题 类型 日期
OL-IP3319CX6 3D model for products with OL-IP3319CX6 package Design support 2023-03-13
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
OL-IP3319CX6 Wafer level chip-size package; 6 bumps (2 x 3); 0.4 mm pitch; 0.95 mm x 1.34 mm x 0.6 mm body Package information 2022-07-13

采用此封装的产品

ESD protection, TVS, filtering and signal conditioning

型号 描述 快速访问
IP3319CX6 Single-channel common-mode filter with integrated ESD protection network