外形图
| 封装版本 | 封装名称 | 封装说明 | 参考 | 发行日期 |
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| SOT1255 | X2SON6 | plastic, leadless thermal enhanced extremely thin small outline package; 6 terminals; 0.4 mm pitch; 1 mm x 0.8 mm x 0.35 mm body | 2015-07-22 |
Boards
| Part number | Description | Type | Quick links | Shop link |
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描述 NEVB-LOGIC02 is a dual in-line logic footprint adapter board, designed to simplify the evaluation of Nexperia logic devices by offering several package footprints.
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类型 Evaluation board
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Quick links
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Shop link
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相关文档
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| X2SON6_SOT1255_mk | "plastic, thermal enhanced extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 0.8 mm x 0.35 mm body" | Marcom graphics | 2017-01-28 |
| SOT1255 | plastic, leadless thermal enhanced extremely thin small outline package; 6 terminals; 0.4 mm pitch; 1 mm x 0.8 mm x 0.35 mm body | Package information | 2022-05-31 |
| SOT1255_147 | X2SON6; Reel pack for SMD, 7''; Q2/T3 product orientation | Packing information | 2020-04-21 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
采用此封装的产品
Analog & Logic ICs
| 型号 | 描述 | 快速访问 |
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