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SOT1269-2

SOT1269-2

plastic, leadless thermal enhanced extremely thin outline package, no leads; 4 terminals; 0.4 mm pitch; 0.6 mm x 0.6 mm x 0.32 mm body

外形图

封装版本 封装名称 封装说明 参考 发行日期
SOT1269-2 X2SON4 plastic, leadless thermal enhanced extremely thin outline package, no leads; 4 terminals; 0.4 mm pitch; 0.6 mm x 0.6 mm x 0.32 mm body 2017-06-30

相关文档

文件名称 标题 类型 日期
Nexperia_document_guide_MiniLogic_MicroPak_201808 MicroPak leadless logic portfolio guide Brochure 2018-09-03
SOT1269-2 3D model for products with SOT1269-2 package Design support 2023-02-02
SOT1269 3D model for products with SOT1269 package Design support 2019-10-07
Nexperia_document_leaflet_Logic_X2SON_packages_062018 X2SON ultra-small 4, 5, 6 & 8-pin leadless packages Leaflet 2018-06-05
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
XSON4_SOT1269-2_mk plastic, leadless thermal enhanced extremely thin outline package, no leads; 4 terminals; 0.4 mm pitch; 0.6 mm x 0.6 mm x 0.32 mm body Marcom graphics 2019-02-04
SOT1269-2_147 X2SON4; Reel pack, SMD, 7"; Q2/T3 standard product orientation; Orderable part number ending ,147 or Z; Ordering code (12NC) ending 147 Packing information 2020-04-21

采用此封装的产品

Analog & Logic ICs

型号 描述 快速访问
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Automotive qualified products (AEC-Q100/Q101)

型号 描述 快速访问
74AUP1G14GX4-Q100 Low-power Schmitt trigger inverter
74LVC1G14GX4-Q100 Single Schmitt trigger inverter