SOT1269-2

X2SON4 (SOT1269-2)

plastic, leadless thermal enhanced extremely thin outline package, no leads; 4 terminals; 0.4 mm pitch; 0.6 mm x 0.6 mm x 0.32 mm body

外形图

封装版本 封装名称 封装说明 参考 发行日期
SOT1269-2 X2SON4 plastic, leadless thermal enhanced extremely thin outline package, no leads; 4 terminals; 0.4 mm pitch; 0.6 mm x 0.6 mm x 0.32 mm body 2017-06-30

相关文档

文件名称 标题 类型 日期
REFLOW_BG-BD-1 Reflow soldering profile Other type 2017-12-01
XSON4_SOT1269-2_mk plastic, leadless thermal enhanced extremely thin outline package, no leads; 4 terminals; 0.4 mm pitch; 0.6 mm x 0.6 mm x 0.32 mm body Marcom graphics 2019-02-04
Nexperia_package_poster Nexperia package poster Leaflet 2019-03-01
Nexperia_document_leaflet_Logic_X2SON_packages_062018 X2SON ultra-small 4, 5, 6 & 8-pin leadless packages Leaflet 2018-06-05
Nexperia_document_guide_MiniLogic_MicroPak_201808 MicroPak leadless logic portfolio guide Brochure 2018-09-03

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