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SOT519-1

SOT519-1

plastic, shrink small outline package; 16 leads; 0.635 mm pitch; 4.9 mm x 3.9 mm x 1.73 mm body

外形图

封装版本 封装名称 封装说明 参考 发行日期
SOT519-1 SSOP16 plastic, shrink small outline package; 16 leads; 0.635 mm pitch; 4.9 mm x 3.9 mm x 1.73 mm body 2003-02-18

相关文档

文件名称 标题 类型 日期
SOT519-1 3D model for products with SOT519-1 package Design support 2023-02-07
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
SOT519-1 plastic, shrink small outline package; 16 leads; 0.635 mm pitch; 4.9 mm x 3.9 mm x 1.73 mm body Package information 2022-06-20
SOT519-1_118 SSOP16; Reel pack for SMD, 13''; Q1/T1 product orientation Packing information 2020-04-21
SSOP-TSSOP-VSO-REFLOW Footprint for reflow soldering Reflow soldering 2009-10-08
SSOP-TSSOP-VSO-WAVE Footprint for wave soldering Wave soldering 2009-10-08

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