外形图
| 封装版本 | 封装名称 | 封装说明 | 参考 | 发行日期 |
|---|---|---|---|---|
| SOT8080-1 | HVQFN28 | plastic, leadless thermal enhanced very thin quad flat package; 28 terminals; 0.4 mm pitch; 4 mm x 4 mm x 0.85 mm body | MO-220 (JEDEC) | 2023-09-12 |
相关文档
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT8080-1 | 3D model for products with SOT8080-1 package | Design support | 2026-02-14 |
| SOT8080-1 | plastic, leadless thermal enhanced very thin quad flat package; 28 terminals;0.4 mm pitch; 4 mm x 4 mm x 0.85 mm body | Package information | 2024-11-22 |