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WLCSP5_2-1-2

WLCSP5 (WLCSP5_2-1-2)

wafer level chip-size package; 5 bumps (2-1-2); 0.4 mm pitch; 0.77 x 1.17 x 0.57 mm body

外形图

封装版本 封装名称 封装说明 参考 发行日期
WLCSP5_2-1-2 WLCSP5 wafer level chip-size package; 5 bumps (2-1-2); 0.4 mm pitch; 0.77 x 1.17 x 0.57 mm body 2010-02-11

相关文档

文件名称 标题 类型 日期
WLCSP5_2-1-2_mk wafer level chip-size package; 5 bumps (2-1-2) Marcom graphics 2017-01-28
Nexperia_package_poster Nexperia package poster Leaflet 2019-03-01

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