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BCP56-16H

80 V, 1 A NPN medium power transistor

NPN medium power transistors in a medium power SOT223 (SC-73) Surface-Mounted Device (SMD) plastic package.

Table 1. Product Overview

Type number

Package

PNP complement

Nexperia

JEITA

JEDEC

BCP56H

SOT223

SC-73

-

BCP53H

BCP56-10H

BCP53-10H

BCP56-16H

BCP53-16H

Features and benefits

  • High collector current capability IC and ICM

  • Three current gain selections

  • High power dissipation capability

  • High-temperature applications up to 175 °C

  • AEC-Q101 qualified

Applications

  • Linear voltage regulators

  • MOSFET drivers

  • Low-side switches

  • Power management

  • Amplifiers

参数类型

型号 Package version Package name Size (mm) Polarity Ptot (mW) VCEO [max] (V) IC [max] (mA) hFE [min] hFE [max] Tj [max] (°C) fT [min] (MHz)
BCP56-16H SOT223 SC-73 6.5 x 3.5 x 1.65 NPN 725 80 1000 100 250 175 100

封装

型号 可订购的器件编号,(订购码(12NC)) 状态 标示 封装 外形图 回流焊/波峰焊 包装
BCP56-16H BCP56-16HX
(934070292115)
Active P5616H SOT223
SC-73
(SOT223)
SOT223 REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT223_115

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
BCP56-16H BCP56-16HX BCP56-16H rohs rhf rhf
品质及可靠性免责声明

Series

文档 (11)

文件名称 标题 类型 日期
BCP56H_SER 80 V, 1 A NPN medium power transistors Data sheet 2018-11-19
SOT223 3D model for products with SOT223 package Design support 2019-01-22
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
SC-73_SOT223_mk plastic, surface-mounted package with increased heatsink; 4 leads; 4.6 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body Marcom graphics 2017-01-28
SOT223 plastic, surface-mounted package with increased heatsink; 4 leads; 2.3 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body Package information 2022-05-30
SOT223_115 SC-73; Reel pack for SMD, 7"; Q3/T4 product orientation Packing information 2024-02-15
BCP56-16H_Nexperia_Product_Quality BCP56-16H Nexperia Product Quality Quality document 2019-05-20
BCP56-16H_Nexperia_Product_Reliability BCP56-16H Nexperia Product Reliability Quality document 2023-04-04
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
BCP56-16H BCP56-16H SPICE model SPICE model 2024-03-26
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08

支持

如果您需要设计/技术支持,请告知我们并填写 应答表 我们会尽快回复您。

模型

文件名称 标题 类型 日期
BCP56-16H BCP56-16H SPICE model SPICE model 2024-03-26
SOT223 3D model for products with SOT223 package Design support 2019-01-22

订购、定价与供货

型号 Orderable part number Ordering code (12NC) 状态 包装 Packing Quantity 在线购买
BCP56-16H BCP56-16HX 934070292115 Active SOT223_115 1,000 订单产品

样品

安世半导体客户可通过我们的销售机构或直接通过在线样品商店订购样品: https://extranet.nexperia.com.

样品订单通常需要2-4天寄送时间。

如果您尚未取得安世半导体的直接采购帐号,我们的全球与区域经销网络可以协助您取得样品。

How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.

可订购部件

型号 可订购的器件编号 订购代码(12NC) 封装 从经销商处购买
BCP56-16H BCP56-16HX 934070292115 SOT223 订单产品