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PMG85XP

20 V, 2 A P-channel Trench MOSFET

P沟道增强型场效应晶体管(FET)，采用使用Trench MOSFET技术的极小型SOT363 (SC-88)表面贴装器件(SMD)塑料封装。

Features and benefits

  • 低阈值电压
  • 极快速开关
  • Trench MOSFET技术

Applications

  • 继电器驱动器
  • 高速线路驱动器
  • 高端负载开关
  • 开关电路

参数类型

型号 Package version Package name Product status Channel type Nr of transistors VDS [max] (V) VGS [max] (V) RDSon [max] @ VGS = 4.5 V (mΩ) RDSon [max] @ VGS = 2.5 V (mΩ) integrated gate-source ESD protection diodes Tj [max] (°C) QGD [typ] (nC) QG(tot) [typ] @ VGS = 4.5 V (nC) Ptot [max] (W) VGSth [typ] (V) Automotive qualified Ciss [typ] (pF) Coss [typ] (pF) Release date
PMG85XP SOT363 TSSOP6 Production P 1 -20 12 115 160 N 150 1 4.8 0.375 -0.9 N 560 80 2011-07-11

封装

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
PMG85XP PMG85XP,115
(934064765115)		 Active YA% SOT363
TSSOP6
(SOT363) 		SOT363 REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT363_115
PMG85XPH
(934064765125)		 Active YA% SOT363_125

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
PMG85XP PMG85XP,115 PMG85XP rohs rhf rhf
PMG85XP PMG85XPH PMG85XP rohs rhf rhf
品质及可靠性免责声明

文档 (22)

文件名称 标题 类型 日期
PMG85XP 20 V, 2 A P-channel Trench MOSFET Data sheet 2017-06-08
AN10273 Power MOSFET single-shot and repetitive avalanche ruggedness rating Application note 2022-06-20
AN10874_ZH LFPAK MOSFET thermal design guide, Chinese version Application note 2020-04-30
AN11113_ZH LFPAK MOSFET thermal design guide - Part 2 Application note 2020-04-30
AN11158 Understanding power MOSFET data sheet parameters Application note 2020-07-06
AN11158_ZH Understanding power MOSFET data sheet parameters Application note 2021-01-04
AN11243 Failure signature of Electrical Overstress on Power MOSFETs Application note 2017-12-21
AN11261 RC Thermal Models Application note 2021-03-18
AN11599 Using power MOSFETs in parallel Application note 2016-07-13
AN90032 Low temperature soldering, application study Application note 2022-02-22
Nexperia_document_guide_MiniLogic_PicoGate_201901 PicoGate leaded logic portfolio guide Brochure 2019-01-07
SOT363 3D model for products with SOT363 package Design support 2018-12-05
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
TSSOP6_SOT363_mk plastic, surface-mounted package; 6 leads; 1.3 mm pitch; 2 mm x 1.25 mm x 0.95 mm body Marcom graphics 2017-01-28
SOT363 plastic, surface-mounted package; 6 leads; 0.65 mm pitch; 2.1 mm x 1.25 mm x 0.95 mm body Package information 2022-06-01
SOT363_115 TSSOP6; Reel pack for SMD, 7"; Q2/T3 product orientation Packing information 2020-06-12
SOT363_125 TSSOP6 ; Reel pack for SMD, 7"; Q3/T4 product orientation Packing information 2020-04-21
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
PMG85XP_27_6_2011 PMG85XP_27_6_2011 Spice parameter SPICE model 2011-08-22
TN00008 Power MOSFET frequently asked questions and answers Technical note 2023-01-12
MAR_SOT363 MAR_SOT363 Topmark Top marking 2013-06-03
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08

支持

如果您需要设计/技术支持，请告知我们并填写 应答表 我们会尽快回复您。

模型

文件名称 标题 类型 日期
PMG85XP_27_6_2011 PMG85XP_27_6_2011 Spice parameter SPICE model 2011-08-22
SOT363 3D model for products with SOT363 package Design support 2018-12-05

订购、定价与供货

型号 Orderable part number Ordering code (12NC) 状态 包装 Packing Quantity 在线购买
PMG85XP PMG85XP,115 934064765115 Active SOT363_115 3,000 订单产品
PMG85XP PMG85XPH 934064765125 Active SOT363_125 3,000 订单产品

样品

安世半导体客户可通过我们的销售机构或直接通过在线样品商店订购样品： https://extranet.nexperia.com.

样品订单通常需要2-4天寄送时间。

如果您尚未取得安世半导体的直接采购帐号，我们的全球与区域经销网络可以协助您取得样品。

How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.

交互式数据手册

可订购部件

型号 可订购的器件编号 订购代码(12NC) 封装 从经销商处购买
PMG85XP PMG85XP,115 934064765115 SOT363 订单产品
PMG85XP PMG85XPH 934064765125 SOT363 订单产品