Register once, drag and drop ECAD models into your CAD tool and speed up your design.
Click here for more informationFeatures and benefits
- 超低QG、QGD和QOSS,可实现系统高效率,尤其是在开关频率较高时
- 带软恢复功能的超快速开关性能;s-factor > 1
- 针对低EMI设计的低峰值和振铃
- 特有的“SchottkyPlus”技术;类肖特基性能:漏电流<1 µA(25 °C时)
- 最适合4.5 V栅极驱动
- 低寄生电感和电阻
- 高可靠性夹片粘合和芯片焊接Mini Power SO8封装;无胶合、无焊线,额定工作温度为175 °C
- 外露引脚,可实现最佳焊点目测
Applications
- 适合服务器和电信的板载DC-DC解决方案
- 电信应用中的次级侧同步整流
- 电压调节器模块(VRM)
- 负载点(POL)模块
- 针对V-core、ASIC、DDR、GPU、VGA和系统组件的功率输出
- 有刷与无刷马达控制
参数类型
型号 | Package version | Package name | Product status | Channel type | Nr of transistors | VDS [max] (V) | RDSon [max] @ VGS = 10 V (mΩ) | RDSon [max] @ VGS = 4.5 V (mΩ) | Tj [max] (°C) | ID [max] (A) | QGD [typ] (nC) | QG(tot) [typ] @ VGS = 4.5 V (nC) | QG(tot) [typ] @ VGS = 10 V (nC) | Ptot [max] (W) | Qr [typ] (nC) | VGSth [typ] (V) | Automotive qualified | Ciss [typ] (pF) | Coss [typ] (pF) | Release date |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
PSMN6R5-30MLD | SOT1210 | LFPAK33 | End of life | N | 1 | 30 | 6.5 | 8.6 | 175 | 65 | 1.7 | 6.4 | 13.6 | 51 | 12.6 | 1.68 | N | 817 | 605 | 2013-10-02 |
封装
下表中的所有产品型号已停产。参见表 停产信息 了解更多信息。
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
PSMN6R5-30MLD | PSMN6R5-30MLDX (934068066115) |
Obsolete |
LFPAK33 (SOT1210) |
SOT1210 |
REFLOW_BG-BD-1
|
SOT1210_115 |
文档 (12)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
PSMN6R5-30MLD | N-channel 30 V, 6.5 mΩ logic level MOSFET in LFPAK33 using NextPowerS3 Technology | Data sheet | 2019-08-13 |
AN10874_ZH | LFPAK MOSFET thermal design guide, Chinese version | Application note | 2020-04-30 |
AN11113_ZH | LFPAK MOSFET thermal design guide - Part 2 | Application note | 2020-04-30 |
AN11261 | RC Thermal Models | Application note | 2021-03-18 |
AN11599 | Using power MOSFETs in parallel | Application note | 2016-07-13 |
AN90003 | LFPAK MOSFET thermal design guide | Application note | 2023-08-22 |
SOT1210 | 3D model for products with SOT1210 package | Design support | 2017-06-30 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
LFPAK33_SOT1210_mk | Plastic, single ended surface mounted package (LFPAK33); 8 leads; 0.65 mm pitch; 2.7 mm x 3.4 mm x 0.9 mm body | Marcom graphics | 2017-01-28 |
SOT1210 | Plastic, single ended surface mounted package (LFPAK33); 8 leads; 0.65 mm pitch | Package information | 2022-06-03 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
TN00008 | Power MOSFET frequently asked questions and answers | Technical note | 2023-01-12 |
支持
如果您需要设计/技术支持,请告知我们并填写 应答表 我们会尽快回复您。
模型
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
SOT1210 | 3D model for products with SOT1210 package | Design support | 2017-06-30 |
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.