Nexperia
Or cross multiple parts
×

PUSB2X4Y

ESD protection for high-speed interfaces

The device is designed to protect high-speed interfaces such as USB 2.0 ports against ElectroStatic Discharge (ESD).

The device includes four high-level ESD protection diode structures for high-speed signal lines. It is encapsulated in a very small SOT363 (SC-88) Surface-Mounted Device (SMD) plastic package.

All signal lines are protected by a special diode configuration offering ultra low line capacitance of 0.85 pF maximum. This configuration provides protection to downstream components from ESD voltages up to ±12 kV contact according to IEC 61000-4-2, level 4.

此产品已停产

Features and benefits

  • System ESD protection for USB 2.0
  • All signal lines with integrated rail-to-rail clamping diodes for downstream ESD protection of ±12 kV according to IEC 61000-4-2, level 4
  • Line capacitance of 0.85 pF maximum for each channel

Applications

The device is designed for receiver and transmitter port protection in:

  • Portable devices
  • TVs and monitors
  • DVD recorders and players
  • Notebooks, mother boards, graphic cards and ports
  • Set-top boxes and game consoles

参数类型

型号 Package name Nr of lines Configuration VRWM (V) Cd [typ] (pF) VESD IEC61000-4-2 (kV)
PUSB2X4Y TSSOP6 4 Unidirectional 5.5 0.55 12/15

封装

下表中的所有产品型号均已停产 。

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
PUSB2X4Y PUSB2X4YH
(934067937125)		 Withdrawn / End-of-life PK% SOT363
TSSOP6
(SOT363) 		SOT363 REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT363_125

环境信息

下表中的所有产品型号均已停产 。

型号 可订购的器件编号 化学成分 RoHS RHF指示符
PUSB2X4Y PUSB2X4YH PUSB2X4Y rohs rhf rhf
品质及可靠性免责声明

文档 (12)

文件名称 标题 类型 日期
PUSB2X4Y ESD protection for high-speed interfaces Data sheet 2020-04-28
AN90032 Low temperature soldering, application study Application note 2022-02-22
Nexperia_document_brochure_ESD-Protection-Applications_022017 ESD Protection Application guide Brochure 2018-12-21
Nexperia_document_guide_MiniLogic_PicoGate_201901 PicoGate leaded logic portfolio guide Brochure 2019-01-07
SOT363 3D model for products with SOT363 package Design support 2018-12-05
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
TSSOP6_SOT363_mk plastic, surface-mounted package; 6 leads; 1.3 mm pitch; 2 mm x 1.25 mm x 0.95 mm body Marcom graphics 2017-01-28
SOT363 plastic, surface-mounted package; 6 leads; 0.65 mm pitch; 2.1 mm x 1.25 mm x 0.95 mm body Package information 2022-06-01
PUSB2X4Y_Nexperia_Product_Reliability PUSB2X4Y Nexperia Product Reliability Quality document 2021-03-19
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
MAR_SOT363 MAR_SOT363 Topmark Top marking 2013-06-03
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08

支持

如果您需要设计/技术支持，请告知我们并填写 应答表 我们会尽快回复您。

模型

文件名称 标题 类型 日期
SOT363 3D model for products with SOT363 package Design support 2018-12-05

How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.

交互式数据手册