74CBTLV3126

4-bit bus switch

The 74CBTLV3126 provides a 4-bit high-speed bus switch with separate output enable inputs (1OEto4OE). The low on-state resistance of the switch allows connections to be made with minimal propagation delay. The switch is disabled (high-impedance OFF-state) when the output enable (nOE) input is LOW.

To ensure the high-impedance OFF-state during power-up or power-down, nOE should be tied to the GND through a pull-down resistor. The minimum value of the resistor is determined by the current-sinking capability of the driver.

Schmitt trigger action at control input makes the circuit tolerant to slower input rise and fall times across the entire V_CC range from 2.3 V to 3.6 V.

This device is fully specified for partial power-down applications using I_OFF. The I_OFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.

特性

Supply voltage range from 2.3 V to 3.6 V
Standard ’126’-type pinout
High noise immunity
Complies with JEDEC standard:
- JESD8-5 (2.3 V to 2.7 V)
- JESD8-B/JESD36 (2.7 V to 3.6 V)
ESD protection:
- HBM JESD22-A114F exceeds 2000 V
- MM JESD22-A115-A exceeds 200 V
- CDM AEC-Q100-011 revision B exceeds 1000 V
5 Ω switch connection between two ports
Rail to rail switching on data I/O ports
CMOS low power consumption
Latch-up performance exceeds 250 mA per JESD78B Class I level A
I_OFF circuitry provides partial Power-down mode operation
Multiple package options
Specified from -40 °C to +85 °C and -40 °C to +125 °C

参数类型

Type number	Product status	V_CC (V)	V_PASS (V)	Logic switching levels	R_ON (Ω)	f_(-3dB) (MHz)	Nr of bits	t_pd (ns)	Power dissipation considerations	T_amb (°C)	R_th(j-a) (K/W)	Ψ_th(j-top) (K/W)	R_th(j-c) (K/W)	Package name
74CBTLV3126BQ	Production	2.3 - 3.6	3.3	CMOS/LVTTL	7	400	4	0.2	very low	-40~125	107	21.3	75	DHVQFN14
74CBTLV3126DS	Production	2.3 - 3.6	3.3	CMOS/LVTTL	7	400	4	0.2	very low	-40~125	148	42.0	-	SSOP16
74CBTLV3126PW	Production	2.3 - 3.6	3.3	CMOS/LVTTL	7	400	4	0.2	very low	-40~125	141	8.0	68	TSSOP14

封装

型号	封装	尺寸版本	回流焊/波峰焊	包装	状态	标示	可订购的器件编号，（订购码(12NC)）
74CBTLV3126BQ	DHVQFN14 (SOT762-1)	SOT762-1		Reel 7” Q1/T1 or Q2/T3	Active	V3126	74CBTLV3126BQ,115 ( 9352 893 42115 )
74CBTLV3126DS	SSOP16 (SOT519-1)	SOT519-1	SSOP-TSSOP-VSO-REFLOW SSOP-TSSOP-VSO-WAVE	Reel 13" Q1/T1	Active	TLV3126	74CBTLV3126DS,118 ( 9352 893 43118 )
74CBTLV3126PW	TSSOP14 (SOT402-1)	SOT402-1	SSOP-TSSOP-VSO-WAVE	Reel 13" Q1/T1	Active	TLV3126	74CBTLV3126PW,118 ( 9352 893 44118 )

停产信息

型号	可订购的器件编号，（订购码(12NC)）	最后一次购买日期	最后一次交货日期	替代产品	状态	备注
74CBTLV3126DS	935289343112
74CBTLV3126PW	935289344112

品质、可靠性及化学成分

型号	可订购的器件编号	化学成分	无铅转换日期	MSL	MSL无铅
74CBTLV3126BQ	74CBTLV3126BQ,115	74CBTLV3126BQ	Always Pb-free	1	1
74CBTLV3126DS	74CBTLV3126DS,118	74CBTLV3126DS	Always Pb-free	1	1
74CBTLV3126PW	74CBTLV3126PW,118	74CBTLV3126PW	Always Pb-free	1	1

品质及可靠性免责声明

文档 (9)

文件名称	标题	类型	日期
74CBTLV3126	4-bit bus switch	Data sheet	2018-10-09
cbtlv3126	74CBTLV3126 IBIS model	IBIS model	2015-02-22
Nexperia_Selection_guide_2022	Nexperia Selection Guide 2022	Selection guide	2022-01-05
SOT762-1	plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 3 mm x 2.5 mm x 1 mm body	Package information	2021-08-17
SSOP-TSSOP-VSO-WAVE	Footprint for wave soldering	Wave soldering	2009-10-08
SOT402-1	plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body	Package information	2020-04-21
SOT519-1	plastic, shrink small outline package; 16 leads; 0.635 mm pitch; 4.9 mm x 3.9 mm x 1.73 mm body	Package information	2020-04-21
SSOP-TSSOP-VSO-WAVE	Footprint for wave soldering	Wave soldering	2009-10-08
SSOP-TSSOP-VSO-REFLOW	Footprint for reflow soldering	Reflow soldering	2009-10-08

支持

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模型

文件名称	标题	类型	日期
cbtlv3126	74CBTLV3126 IBIS model	IBIS model	2015-02-22

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