
74LVC3G17
Applications
Schmitt triggers are able to transform the slowly changing input signals into sharply defined jitter free output signals. These devices are useful in systems with noisy input signals that have large slew rates and can cause the oscillations or undefined logic levels at outputs. Integration of Schmitt triggers inputs saves the cost and space of using standalone Schmitt triggers on boards.
Schmitt trigger products are available in standard SO, TSSOP, PicoGate and innovative leadless MicroPak and DQFN packages for PCB space saving.
Features and benefits
- Prevents multiple switching when driven by slow edges
- Cleans up the noisy signals
- Reshapes the signals in complex layouts
- Suitable for mixed 3.3 V and 5.0 V applications
- Wide voltage supply range
- Input hysteresis
- Open drain output options
- CMOS and TTL variants
- Overvoltage tolerant input options
Applications
- Sine wave to square wave conversion
- Interface between analog and digital environments
- Increase noise immunity in design
- Relaxation oscillators
参数类型
型号 | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
---|---|---|---|---|---|---|---|---|---|---|---|
74LVC3G17DC | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 175 | 3 | low | -40~125 | 205 | 31.9 | 115 | VSSOP8 |
74LVC3G17DP | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 175 | 3 | low | -40~125 | 217 | 18.5 | 106 | TSSOP8 |
74LVC3G17GN | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 175 | 3 | low | -40~125 | 243 | 152 | XSON8 | |
74LVC3G17GS | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 175 | 3 | low | -40~125 | 281 | 149 | XSON8 | |
74LVC3G17GT | 1.65 - 5.5 | CMOS/LVTTL | ± 32 | 175 | 3 | low | -40~125 | 334 | 5.5 | 162 | XSON8 |
封装
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
74LVC3G17DC | 74LVC3G17DC,125 (935275563125) |
Active | V17 |
![]() VSSOP8 (SOT765-1) |
SOT765-1 | SOT765-1_125 | |
74LVC3G17DP | 74LVC3G17DP,125 (935275564125) |
Active | V17 |
![]() TSSOP8 (SOT505-2) |
SOT505-2 | SOT505-2_125 | |
74LVC3G17GN | 74LVC3G17GN,115 (935292256115) |
Active | VV |
![]() XSON8 (SOT1116) |
SOT1116 |
REFLOW_BG-BD-1
|
SOT1116_115 |
74LVC3G17GS | 74LVC3G17GS,115 (935292813115) |
Active | VV |
![]() XSON8 (SOT1203) |
SOT1203 |
REFLOW_BG-BD-1
|
SOT1203_115 |
74LVC3G17GT | 74LVC3G17GT,115 (935278935115) |
Active | V17 |
![]() XSON8 (SOT833-1) |
SOT833-1 | SOT833-1_115 |
下表中的所有产品型号均已停产 。
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
74LVC3G17GD | 74LVC3G17GD,125 (935286864125) |
Obsolete | V17 |
![]() XSON8 (SOT996-2) |
SOT996-2 | SOT996-2_125 | |
74LVC3G17GF | 74LVC3G17GF,115 (935291518115) |
Obsolete | no package information | ||||
74LVC3G17GM | 74LVC3G17GM,125 (935277249125) |
Obsolete |
![]() XQFN8 (SOT902-2) |
SOT902-2 | SOT902-2_125 | ||
74LVC3G17GM,115 (935277249115) |
Obsolete | 暂无信息 |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
---|---|---|---|---|
74LVC3G17DC | 74LVC3G17DC,125 | 74LVC3G17DC |
|
![]() |
74LVC3G17DP | 74LVC3G17DP,125 | 74LVC3G17DP |
|
![]() |
74LVC3G17GN | 74LVC3G17GN,115 | 74LVC3G17GN |
|
![]() |
74LVC3G17GS | 74LVC3G17GS,115 | 74LVC3G17GS |
|
![]() |
74LVC3G17GT | 74LVC3G17GT,115 | 74LVC3G17GT |
|
![]() |
下表中的所有产品型号均已停产 。
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
---|---|---|---|---|
74LVC3G17GD | 74LVC3G17GD,125 | 74LVC3G17GD |
|
![]() |
74LVC3G17GF | 74LVC3G17GF,115 | 74LVC3G17GF |
|
![]() |
74LVC3G17GM | 74LVC3G17GM,125 | 74LVC3G17GM |
|
![]() |
74LVC3G17GM | 74LVC3G17GM,115 | 74LVC3G17GM |
|
![]() |
文档 (28)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
AN11009 | Pin FMEA for LVC family | Application note | 2019-01-09 |
AN90063 | Questions about package outline drawings | Application note | 2025-06-13 |
001aab107 | Block diagram: 74LVC3G17DC, 74LVC3G17DP, 74LVC3G17GM, 74LVC3G17GT | Block diagram | 2009-11-03 |
Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
SOT765-1 | 3D model for products with SOT765-1 package | Design support | 2020-01-22 |
SOT505-2 | 3D model for products with SOT505-2 package | Design support | 2019-01-18 |
SOT1116 | 3D model for products with SOT1116 package | Design support | 2023-02-02 |
SOT1203 | 3D model for products with SOT1203 package | Design support | 2023-02-02 |
SOT833-1 | 3D model for products with SOT833-1 package | Design support | 2021-01-28 |
lvc3g17 | 74LVC3G17 IBIS model | IBIS model | 2015-01-15 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
VSSOP8_SOT765-1_mk | plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body | Marcom graphics | 2017-01-28 |
XQFN8_SOT902-2_mk | plastic, extremely thin quad flat package; 8 terminals; 0.55 mm pitch; 1.6 mm x 1.6 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
XSON8_SOT1203_mk | plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm body | Marcom graphics | 2019-02-04 |
SOT765-1 | plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body | Package information | 2022-06-03 |
SOT505-2 | plastic, thin shrink small outline package; 8 leads; 0.65 mm pitch; 3 mm x 3 mm x 1.1 mm body | Package information | 2022-06-03 |
SOT996-2 | plastic, leadless extremely thin small outline package; 8 terminals; 0.5 mm pitch; 3 mm x 2 mm x 0.5 mm body | Package information | 2020-04-21 |
SOT902-2 | plastic, leadless extremely thin quad flat package; 8 terminals; 0.5 mm pitch; 1.6 mm x 1.6 mm x 0.5 mm body | Package information | 2020-04-21 |
SOT1116 | plastic, leadless extremely thin small outline package; 8 terminals; 0.3 mm pitch; 1.2 mm x 1 mm x 0.35 mm body | Package information | 2022-06-02 |
SOT1203 | plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm body | Package information | 2022-06-03 |
SOT833-1 | plastic, leadless extremely thin small outline package; 8 terminals; 0.5 mm pitch; 1 mm x 1.95 mm x 0.5 mm body | Package information | 2022-06-03 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
lvc | lvc Spice model | SPICE model | 2013-05-07 |
MAR_SOT1116 | MAR_SOT1116 Topmark | Top marking | 2013-06-03 |
MAR_SOT1203 | MAR_SOT1203 Topmark | Top marking | 2013-06-03 |
MAR_SOT833 | MAR_SOT833 Topmark | Top marking | 2013-06-03 |
支持
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模型
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
SOT765-1 | 3D model for products with SOT765-1 package | Design support | 2020-01-22 |
SOT505-2 | 3D model for products with SOT505-2 package | Design support | 2019-01-18 |
SOT1116 | 3D model for products with SOT1116 package | Design support | 2023-02-02 |
SOT1203 | 3D model for products with SOT1203 package | Design support | 2023-02-02 |
SOT833-1 | 3D model for products with SOT833-1 package | Design support | 2021-01-28 |
lvc3g17 | 74LVC3G17 IBIS model | IBIS model | 2015-01-15 |
lvc | lvc Spice model | SPICE model | 2013-05-07 |
Ordering, pricing & availability
样品
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