双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)
SOT1061D

BC55xPAS-Q series

60 V, 1 A NPN medium power transistors

NPN medium power transistor series encapsulated in an ultra thin DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic package with medium power capability and visible and solderable side pads.

Features and benefits

  • High collector current capability IC and ICM

  • Reduced Printed-Circuit Board (PCB) area requirements

  • Exposed heat sink for excellent thermal and electrical conductivity

  • Two current gain selections

  • Leadless very small SMD plastic package with medium power capability

  • Suitable for Automatic Optical Inspection (AOI) of solder joint

  • Qualified according to AEC-Q101 and recommended for use in automotive applications

Applications

  • Linear voltage regulators

  • Battery driven devices

  • MOSFET drivers

  • High-side switches

  • Power management

  • Amplifiers

参数类型

型号 Package version Package name Size (mm) channel type (e) Ptot (mW) VCEO [max] (V) IC [max] (mA) hFE [min] hFE [max] TJ [max] (°C) fT [min] (MHz) Automotive qualified
BC55-10PAS-Q SOT1061D DFN2020D-3 2 x 2 x 0.65 NPN 420 60 1000 63 160 150 100 Y
BC55-16PAS-Q SOT1061D DFN2020D-3 2 x 2 x 0.65 NPN 420 60 1000 100 250 150 100 Y
BC55PAS-Q SOT1061D DFN2020D-3 2 x 2 x 0.65 NPN 420 60 1000 63 250 150 100 Y

封装

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
BC55-10PAS-Q BC55-10PAS-QX
(934666133115)		 Active CH SOT1061D
DFN2020D-3
(SOT1061D) 		SOT1061D REFLOW_BG-BD-1
SOT1061D_115
BC55-16PAS-Q BC55-16PAS-QX
(934666134115)		 Active CJ SOT1061D
DFN2020D-3
(SOT1061D) 		SOT1061D REFLOW_BG-BD-1
SOT1061D_115
BC55PAS-Q BC55PAS-QX
(934664895115)		 Active CG SOT1061D
DFN2020D-3
(SOT1061D) 		SOT1061D REFLOW_BG-BD-1
SOT1061D_115

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
BC55-10PAS-Q BC55-10PAS-QX BC55-10PAS-Q rohs rhf rhf
BC55-16PAS-Q BC55-16PAS-QX BC55-16PAS-Q rohs rhf rhf
BC55PAS-Q BC55PAS-QX BC55PAS-Q rohs rhf rhf
品质及可靠性免责声明

文档 (11)

文件名称 标题 类型 日期
BC55XPAS-Q_SER 60 V, 1 A NPN medium power transistors Data sheet 2023-05-02
AN90023 Thermal performance of DFN packages Application note 2020-11-23
AN90023_ZH Thermal performance of DFN packages Application note 2021-02-26
AN90063 Questions about package outline drawings Application note 2025-10-22
Nexperia_asset_document_brochure_autoDFN_CN_LR 小巧轻便的汽车 二极管和晶体管 Brochure 2022-04-26
SOT1061D 3D model for products with SOT1061D package Design support 2021-07-30
Nexperia_AutoDFN_factsheet_2022 Small & light automotive diodes and transistors Leaflet 2022-04-13
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DFN2020D-3_SOT1061D_mk plastic, thermal enhanced ultra thin small outline package; no leads; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body Marcom graphics 2017-01-28
SOT1061D plastic, leadless thermal enhanced ultra thin small outline package with side-wettable flanks (SWF); no leads; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body Package information 2022-10-10
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06

支持

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模型

文件名称 标题 类型 日期
SOT1061D 3D model for products with SOT1061D package Design support 2021-07-30

Ordering, pricing & availability

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