双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

74LVC245A-Q100; 74LVCH245A-Q100

Octal bus transceiver; 3-state

The 74LVC245A-Q100; 74LVCH245A-Q100 is an 8-bit transceiver with 3-state outputs. The device features an output enable (OE) and send/receive (DIR) for direction control. A HIGH on OE causes the outputs to assume a high-impedance OFF-state. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V environments.

Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times.

This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.

Features and benefits

  • Automotive product qualification in accordance with AEC-Q100 (Grade 1)

    • Specified from -40 °C to +85 °C and from -40 °C to +125 °C

  • 5 V tolerant inputs/outputs for interfacing with 5 V logic

  • Wide supply voltage range from 1.2 V to 3.6 V

  • CMOS low-power consumption

  • Direct interface with TTL levels

  • Overvoltage tolerant inputs to 5.5 V

  • Bus hold on all data inputs (74LVCH245A-Q100 only)

  • IOFF circuitry provides partial Power-down mode operation

  • Complies with JEDEC standard:

    • JESD8-7A (1.65 V to 1.95 V)

    • JESD8-5A (2.3 V to 2.7 V)

    • JESD8-C/JESD36 (2.7 V to 3.6 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints

参数类型

型号 VCC (V) Logic switching levels Output drive capability (mA) fmax (MHz) Nr of bits Power dissipation considerations Tamb (°C) Rth(j-a) (K/W) Ψth(j-top) (K/W) Rth(j-c) (K/W) Package name
74LVC245ABQ-Q100 1.2 - 3.6 CMOS/LVTTL +/- 24 175 8 low -40~125 77 8.1 48 DHVQFN20
74LVC245AD-Q100 1.2 - 3.6 CMOS/LVTTL +/- 24 175 8 low -40~125 84 26.4 60 SO20
74LVC245APW-Q100 1.2 - 3.6 CMOS/LVTTL +/- 24 175 8 low -40~125 100 4.4 44 TSSOP20
74LVCH245ABQ-Q100 1.2 - 3.6 CMOS/LVTTL +/- 24 175 8 low -40~125 77 8.1 48 DHVQFN20
74LVCH245AD-Q100 1.2 - 3.6 CMOS/LVTTL +/- 24 175 8 low -40~125 84 26.4 60 SO20
74LVCH245APW-Q100 1.2 - 3.6 CMOS/LVTTL +/- 24 175 8 low -40~125 100 4.4 44 TSSOP20

封装

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
74LVC245ABQ-Q100 74LVC245ABQ-Q100X
(935299254115)		 Active LVC245A SOT764-1
DHVQFN20
(SOT764-1) 		SOT764-1 SOT764-1_115
74LVC245AD-Q100 74LVC245AD-Q100J
(935299256118)		 Active 74LVC245AD SOT163-1
SO20
(SOT163-1) 		SOT163-1 WAVE_BG-BD-1
SOT163-1_118
74LVC245APW-Q100 74LVC245APW-Q100J
(935299257118)		 Active LVC245A SOT360-1
TSSOP20
(SOT360-1) 		SOT360-1 SSOP-TSSOP-VSO-WAVE
SOT360-1_118
74LVCH245ABQ-Q100 74LVCH245ABQ-Q100X
(935299492115)		 Active LVCH245A SOT764-1
DHVQFN20
(SOT764-1) 		SOT764-1 SOT764-1_115
74LVCH245AD-Q100 74LVCH245AD-Q100J
(935299493118)		 Active 74LVCH245AD SOT163-1
SO20
(SOT163-1) 		SOT163-1 WAVE_BG-BD-1
SOT163-1_118
74LVCH245APW-Q100 74LVCH245APW-Q100J
(935299494118)		 Active VCH245A SOT360-1
TSSOP20
(SOT360-1) 		SOT360-1 SSOP-TSSOP-VSO-WAVE
SOT360-1_118

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74LVC245ABQ-Q100 74LVC245ABQ-Q100X 74LVC245ABQ-Q100 rohs rhf rhf
74LVC245AD-Q100 74LVC245AD-Q100J 74LVC245AD-Q100 rohs rhf rhf
74LVC245APW-Q100 74LVC245APW-Q100J 74LVC245APW-Q100 rohs rhf rhf
74LVCH245ABQ-Q100 74LVCH245ABQ-Q100X 74LVCH245ABQ-Q100 rohs rhf rhf
74LVCH245AD-Q100 74LVCH245AD-Q100J 74LVCH245AD-Q100 rohs rhf rhf
74LVCH245APW-Q100 74LVCH245APW-Q100J 74LVCH245APW-Q100 rohs rhf rhf
品质及可靠性免责声明

文档 (17)

文件名称 标题 类型 日期
74LVC_LVCH245A_Q100 Octal bus transceiver; 3-state Data sheet 2023-08-08
AN11009 Pin FMEA for LVC family Application note 2019-01-09
AN263 Power considerations when using CMOS and BiCMOS logic devices Application note 2023-02-07
AN90063 Questions about package outline drawings Application note 2025-06-13
SOT764-1 3D model for products with SOT764-1 package Design support 2019-10-03
SOT163-1 3D model for products with SOT163-1 package Design support 2020-01-22
SOT360-1 3D model for products with SOT360-1 package Design support 2020-01-22
lvc245a lvc245a IBIS model IBIS model 2021-02-02
lvch245a lvch245a IBIS model IBIS model 2013-04-09
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DHVQFN20_SOT764-1_mk plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body Marcom graphics 2017-01-28
TSSOP20_SOT360-1_mk plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body Marcom graphics 2017-01-28
SOT764-1 plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body Package information 2022-06-21
SOT163-1 plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm body Package information 2024-11-15
SOT360-1 plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body Package information 2024-11-15
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08
SSOP-TSSOP-VSO-WAVE Footprint for wave soldering Wave soldering 2009-10-08

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模型

文件名称 标题 类型 日期
SOT764-1 3D model for products with SOT764-1 package Design support 2019-10-03
SOT163-1 3D model for products with SOT163-1 package Design support 2020-01-22
SOT360-1 3D model for products with SOT360-1 package Design support 2020-01-22
lvc245a lvc245a IBIS model IBIS model 2021-02-02
lvch245a lvch245a IBIS model IBIS model 2013-04-09

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