×

BUK9875-100A

N-channel TrenchMOS logic level FET

逻辑电平N沟道增强型场效应晶体管(FET),采用塑料封装,使用TrenchMOS技术。该产品设计符合相应AEC标准,适用于汽车电子关键型应用。

Features and benefits

  • 低导通电阻,因而导通损耗很小
  • 符合Q101标准
  • 适用于逻辑电平栅极驱动源

Applications

  • 12 V、24 V和42 V负载
  • 汽车和通用电源开关
  • 马达、灯具和螺线管

参数类型

型号 Package version Package name Product status Channel type Nr of transistors VDS [max] (V) RDSon [max] @ VGS = 10 V (mΩ) RDSon [max] @ VGS = 5 V (mΩ) RDSon [max] @ VGS = 4.5 V (mΩ) Tj [max] (°C) ID [max] (A) Ptot [max] (W) Qr [typ] (nC) VGSth [typ] (V) Automotive qualified Ciss [typ] (pF) Coss [typ] (pF) Release date
BUK9875-100A SOT223 SC-73 Production N 1 100 72 75 84 150 7 8 220 1.5 Y 1270 140 2011-01-24

封装

型号 可订购的器件编号,(订购码(12NC)) 状态 标示 封装 外形图 回流焊/波峰焊 包装
BUK9875-100A BUK9875-100A/CUX
(934068286115)
Active 987510 A SOT223
SC-73
(SOT223)
SOT223 REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT223_115

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
BUK9875-100A BUK9875-100A/CUX BUK9875-100A rohs rhf rhf
品质及可靠性免责声明

文档 (19)

文件名称 标题 类型 日期
BUK9875-100A N-channel TrenchMOS logic level FET Data sheet 2017-04-11
AN10273 Power MOSFET single-shot and repetitive avalanche ruggedness rating Application note 2022-06-20
AN10874_ZH LFPAK MOSFET thermal design guide, Chinese version Application note 2020-04-30
AN11113_ZH LFPAK MOSFET thermal design guide - Part 2 Application note 2020-04-30
AN11156 Using Power MOSFET Zth Curves Application note 2021-01-04
AN11158 Understanding power MOSFET data sheet parameters Application note 2020-07-06
AN11158_ZH Understanding power MOSFET data sheet parameters Application note 2021-01-04
AN11160 Designing RC Snubbers Application note 2023-02-03
AN11243 Failure signature of Electrical Overstress on Power MOSFETs Application note 2017-12-21
AN11261 RC Thermal Models Application note 2021-03-18
AN11599 Using power MOSFETs in parallel Application note 2016-07-13
SOT223 3D model for products with SOT223 package Design support 2019-01-22
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
SC-73_SOT223_mk plastic, surface-mounted package with increased heatsink; 4 leads; 4.6 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body Marcom graphics 2017-01-28
SOT223 plastic, surface-mounted package with increased heatsink; 4 leads; 2.3 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body Package information 2022-05-30
SOT223_115 SC-73; Reel pack for SMD, 7"; Q3/T4 product orientation Packing information 2024-02-15
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
TN00008 Power MOSFET frequently asked questions and answers Technical note 2023-01-12
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08

支持

如果您需要设计/技术支持,请告知我们并填写 应答表 我们会尽快回复您。

模型

文件名称 标题 类型 日期
SOT223 3D model for products with SOT223 package Design support 2019-01-22

订购、定价与供货

型号 Orderable part number Ordering code (12NC) 状态 包装 Packing Quantity 在线购买
BUK9875-100A BUK9875-100A/CUX 934068286115 Active SOT223_115 1,000 订单产品

样品

安世半导体客户可通过我们的销售机构或直接通过在线样品商店订购样品: https://extranet.nexperia.com.

样品订单通常需要2-4天寄送时间。

如果您尚未取得安世半导体的直接采购帐号,我们的全球与区域经销网络可以协助您取得样品。

How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.

可订购部件

型号 可订购的器件编号 订购代码(12NC) 封装 从经销商处购买
BUK9875-100A BUK9875-100A/CUX 934068286115 SOT223 订单产品