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BCP55-10-Q

60 V, 1 A NPN medium power transistors

NPN medium power transistor series in a small SOT223 (SC-73) Surface-Mounted Device (SMD) plastic package.

Table 1. Product overview

Type number

Package

NPN complement

Nexperia

JEITA

BCP55-Q

SOT223

SC73

BCP52-Q

BCP55-10-Q

BCP52-10-Q

BCP55-16-Q

BCP52-16-Q

Features and benefits

  • High current

  • Three current gain selections

  • High power dissipation capability

  • Qualified according to AEC-Q101 and recommended for use in automotive applications

Applications

  • Linear voltage regulators

  • Power management

  • Low-side switches

  • MOSFET drivers

  • Battery-driven devices

  • Amplifiers

参数类型

型号 Package version Package name Size (mm) Polarity Ptot (mW) VCEO [max] (V) IC [max] (mA) hFE [min] hFE [max] Tj [max] (°C) fT [min] (MHz) Automotive qualified
BCP55-10-Q SOT223 SC-73 6.5 x 3.5 x 1.65 NPN 650 60 1000 63 160 150 100 Y

封装

型号 可订购的器件编号,(订购码(12NC)) 状态 标示 封装 外形图 回流焊/波峰焊 包装
BCP55-10-Q BCP55-10-QX
(934663697115)
Active BCP55 /10 SOT223
SC-73
(SOT223)
SOT223 REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT223_115

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
BCP55-10-Q BCP55-10-QX BCP55-10-Q rohs rhf rhf
品质及可靠性免责声明

文档 (10)

文件名称 标题 类型 日期
BCP55-Q_SER 60 V, 1 A NPN medium power transistors Data sheet 2022-07-01
SOT223 3D model for products with SOT223 package Design support 2019-01-22
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
SC-73_SOT223_mk plastic, surface-mounted package with increased heatsink; 4 leads; 4.6 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body Marcom graphics 2017-01-28
SOT223 plastic, surface-mounted package with increased heatsink; 4 leads; 2.3 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body Package information 2022-05-30
SOT223_115 SC-73; Reel pack for SMD, 7"; Q3/T4 product orientation Packing information 2024-02-15
BCP55-10-Q_Nexperia_Product_Reliability BCP55-10-Q Nexperia Product Reliability Quality document 2023-04-04
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
BCP55-10-Q BCP55-10-Q SPICE model SPICE model 2024-03-26
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08

支持

如果您需要设计/技术支持,请告知我们并填写 应答表 我们会尽快回复您。

模型

文件名称 标题 类型 日期
BCP55-10-Q BCP55-10-Q SPICE model SPICE model 2024-03-26
SOT223 3D model for products with SOT223 package Design support 2019-01-22

订购、定价与供货

型号 Orderable part number Ordering code (12NC) 状态 包装 Packing Quantity 在线购买
BCP55-10-Q BCP55-10-QX 934663697115 Active SOT223_115 1,000 订单产品

样品

安世半导体客户可通过我们的销售机构或直接通过在线样品商店订购样品: https://extranet.nexperia.com.

样品订单通常需要2-4天寄送时间。

如果您尚未取得安世半导体的直接采购帐号,我们的全球与区域经销网络可以协助您取得样品。

How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.

可订购部件

型号 可订购的器件编号 订购代码(12NC) 封装 从经销商处购买
BCP55-10-Q BCP55-10-QX 934663697115 SOT223 订单产品