Features and benefits
- Low diode capacitance 
- Low forward voltage 
- Very small SMD plastic packages 
- AEC-Q101 qualified 
Applications
- Digital applications: - Ultra high-speed switching 
- Clamping circuits 
 
- RF applications: - Diode ring mixer 
- RF detector 
- RF voltage doubler 
 
参数类型
| 型号 | 
|---|
封装
下表中的所有产品型号均已停产 。
| 型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 | 
|---|---|---|---|---|---|---|---|
| 1PS88SB82 | 1PS88SB82,165 (934056580165) | Obsolete | E1% |   TSSOP6 (SOT363) | SOT363 | REFLOW_BG-BD-1 WAVE_BG-BD-1 | SOT363_165 | 
| 1PS88SB82,115 (934056580115) | Withdrawn / End-of-life | E1% | SOT363_115 | 
文档 (11)
| 文件名称 | 标题 | 类型 | 日期 | 
|---|---|---|---|
| 1PS66SB82_1PS88SB82 | 15 V, 30 mA low Cd Schottky barrier diodes | Data sheet | 2018-08-28 | 
| AN90032 | Low temperature soldering, application study | Application note | 2022-02-22 | 
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 | 
| Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 | 
| SOT363 | 3D model for products with SOT363 package | Design support | 2018-12-05 | 
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 | 
| TSSOP6_SOT363_mk | plastic, surface-mounted package; 6 leads; 1.3 mm pitch; 2 mm x 1.25 mm x 0.95 mm body | Marcom graphics | 2017-01-28 | 
| SOT363 | plastic, surface-mounted package; 6 leads; 0.65 mm pitch; 2.1 mm x 1.25 mm x 0.95 mm body | Package information | 2022-06-01 | 
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 | 
| MAR_SOT363 | MAR_SOT363 Topmark | Top marking | 2013-06-03 | 
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 | 
