特性
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Fully automotive qualified to beyond AEC-Q101:
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-55 °C to +175 °C rating suitable for thermally demanding environments
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LFPAK88 package:
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Designed for smaller footprint and improved power density over older wire bond packages such as D²PAK for today’s space constrained high power automotive applications
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Thin package and copper clip enables LFPAK88 to be highly efficient thermally
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LFPAK copper clip technology enabling improvements over wire bond packages by:
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Increased maximum current capability and excellent current spreading
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Improved RDSon
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Low source inductance
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Low thermal resistance Rth
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LFPAK Gull Wing leads:
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Flexible leads enabling high Board Level Reliability absorbing mechanical and thermal cycling stress, unlike traditional QFN packages
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Visual (AOI) soldering inspection, no need for expensive x-ray equipment
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Easy solder wetting for good mechanical solder joint
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Unique 40 V Trench 9 superjunction technology:
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Reduced cell pitch and superjunction platform enables lower RDSon in the same footprint
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Improved SOA and avalanche capability compared to standard TrenchMOS
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Tight VGS(th) limits enable easy paralleling of MOSFETs
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目标应用
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12 V automotive systems
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48 V DC/DC systems (on 12 V secondary side)
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Higher power motors, lamps and solenoid control
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Reverse polarity protection
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Ultra high performance power switching
参数类型
型号 | Package version | Package name | Product status | Channel type | Nr of transistors | VDS [max] (V) | RDSon [max] @ VGS = 10 V (mΩ) | Tj [max] (°C) | ID [max] (A) | QGD [typ] (nC) | QG(tot) [typ] @ VGS = 10 V (nC) | Ptot [max] (W) | Qr [typ] (nC) | VGSth [typ] (V) | Automotive qualified | Ciss [typ] (pF) | Coss [typ] (pF) | Date |
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BUK7S0R5-40H | SOT1235 | LFPAK88 | Production | N | 1 | 40 | 0.55 | 175 | 500 | 32 | 190 | 375 | 93 | 3 | Y | 15116 | 2718 | 2021-01-28 |
PCB Symbol, Footprint and 3D Model
Model Name | 描述 |
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Package
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
BUK7S0R5-40H | BUK7S0R5-40HJ ( 9346 613 15118 ) | Active | 7S0R540H | ![]() LFPAK88 (SOT1235) | SOT1235 | REFLOW_BG-BD-1 | SOT1235_118 |
BUK7S0R5-40H/A002 | BUK7S0R5-40H/A002J ( 9346 654 40118 ) | Active | 7S0R540H | ![]() LFPAK88 (SOT1235) | SOT1235 | REFLOW_BG-BD-1 | SOT1235_118 |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
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BUK7S0R5-40H | BUK7S0R5-40HJ | BUK7S0R5-40H | ![]() | |
BUK7S0R5-40H/A002 | BUK7S0R5-40H/A002J | BUK7S0R5-40H/A002 | ![]() |
文档 (14)
文件名称 | 标题 | 类型 | 日期 |
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BUK7S0R5-40H | N-channel 40 V, 0.5 mOhm standard level MOSFET in LFPAK88 | Data sheet | 2021-04-06 |
AN10273 | Power MOSFET single-shot and repetitive avalanche ruggedness rating | Application note | 2022-06-20 |
AN11158 | Understanding power MOSFET data sheet parameters | Application note | 2020-07-06 |
AN11599 | Using power MOSFETs in parallel | Application note | 2016-07-13 |
AN90003 | LFPAK MOSFET thermal design guide | Application note | 2023-08-22 |
AN90016 | Maximum continuous currents in NEXPERIA LFPAK power MOSFETs | Application note | 2020-09-03 |
AN90017 | Load switches for mobile and computing applications | Application note | 2020-09-02 |
SOT1235 | 3D model for products with SOT1235 package | Design support | 2020-01-22 |
BUK7xxxx-40H_LTspice_V3 | BUK7xxxx-40H Precision ElectroThermal (PET) LTspice model | PET SPICE model | 2022-09-26 |
BUK7S0R5-40H | BUK7S0R5-40H SPICE model | SPICE model | 2021-04-12 |
TN00008 | Power MOSFET frequently asked questions and answers | Technical note | 2023-01-12 |
BUK7S0R5-40H_Cauer | BUK7S0R5-40H Cauer thermal model | Thermal model | 2021-04-12 |
SOT1235_118 | LFPAK88; Reel pack, SMD, 13"; Q1/T1 standard product orientation; Orderable part number ending ,118 or Z; Ordering code (12NC) ending 118 | Packing information | 2020-04-21 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
支持
如果您需要设计/技术支持,请告知我们并填写 应答表, 我们会尽快回复您。
模型
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
SOT1235 | 3D model for products with SOT1235 package | Design support | 2020-01-22 |
BUK7xxxx-40H_LTspice_V3 | BUK7xxxx-40H Precision ElectroThermal (PET) LTspice model | PET SPICE model | 2022-09-26 |
BUK7S0R5-40H | BUK7S0R5-40H SPICE model | SPICE model | 2021-04-12 |
BUK7S0R5-40H_Cauer | BUK7S0R5-40H Cauer thermal model | Thermal model | 2021-04-12 |
PCB Symbol, Footprint and 3D Model
Model Name | 描述 |
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订购、定价与供货
型号 | Orderable part number | Ordering code (12NC) | 包装 | Packing quantity | 在线购买 |
---|---|---|---|---|---|
BUK7S0R5-40H | BUK7S0R5-40HJ | 934661315118 | SOT1235_118 | - | 订单产品 |
BUK7S0R5-40H/A002 | BUK7S0R5-40H/A002J | 934665440118 | SOT1235_118 | - | 订单产品 |
样品
安世半导体客户可通过我们的销售机构或直接通过在线样品商店订购样品: https://extranet.nexperia.com.
样品订单通常需要2-4天寄送时间。
如果您尚未取得安世半导体的直接采购帐号,我们的全球与区域经销网络可以协助您取得样品。
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.