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BUK7Y10-30B

N-channel TrenchMOS standard level FET

标准电平N沟道增强型场效应晶体管(FET),采用塑料封装,使用恩智浦高性能汽车电子(HPA) TrenchMOS技术。该产品设计符合相应AEC标准,适用于汽车电子关键型应用。

该产品已停产。参见单击此处了解停产信息和替代产品。

Features and benefits

  • 符合Q101标准
  • 适用于标准电平栅极驱动源
  • 额定温度为175 °C,适用于对热性能要求苛刻的环境

Applications

  • 12 V负载
  • 汽车系统
  • 通用电源开关
  • 马达、灯具和螺线管

参数类型

型号 Package version Package name Product status Channel type Nr of transistors VDS [max] (V) RDSon [max] @ VGS = 10 V (mΩ) Tj [max] (°C) ID [max] (A) QGD [typ] (nC) QG(tot) [typ] @ VGS = 10 V (nC) Ptot [max] (W) Qr [typ] (nC) VGSth [typ] (V) Automotive qualified Ciss [typ] (pF) Coss [typ] (pF) Release date
BUK7Y10-30B SOT669 LFPAK56; Power-SO8 End of life N 1 30 10 175 67 5.6 18.8 85 38 3 Y 887 332 2011-01-27

封装

下表中的所有产品型号已停产。参见表 停产信息 了解更多信息。

型号 可订购的器件编号,(订购码(12NC)) 状态 标示 封装 外形图 回流焊/波峰焊 包装
BUK7Y10-30B BUK7Y10-30B,115
(934063316115)
Obsolete SOT669
LFPAK56; Power-SO8
(SOT669)
SOT669 REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT669_115

环境信息

下表中的所有产品型号已停产。参见表 停产信息 了解更多信息。

型号 可订购的器件编号 化学成分 RoHS RHF指示符
BUK7Y10-30B BUK7Y10-30B,115 BUK7Y10-30B rohs rhf
品质及可靠性免责声明

文档 (21)

文件名称 标题 类型 日期
BUK7Y10-30B N-channel TrenchMOS standard level FET Data sheet 2017-05-04
AN10273 Power MOSFET single-shot and repetitive avalanche ruggedness rating Application note 2022-06-20
AN10874_ZH LFPAK MOSFET thermal design guide, Chinese version Application note 2020-04-30
AN11113_ZH LFPAK MOSFET thermal design guide - Part 2 Application note 2020-04-30
AN11156 Using Power MOSFET Zth Curves Application note 2021-01-04
AN11158 Understanding power MOSFET data sheet parameters Application note 2020-07-06
AN11158_ZH Understanding power MOSFET data sheet parameters Application note 2021-01-04
AN11160 Designing RC Snubbers Application note 2023-02-03
AN11243 Failure signature of Electrical Overstress on Power MOSFETs Application note 2017-12-21
AN11261 RC Thermal Models Application note 2021-03-18
AN11599 Using power MOSFETs in parallel Application note 2016-07-13
SOT669 3D model for products with SOT669 package Design support 2017-06-30
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
LFPAK56_POWER-SO8_SOT669_mk plastic, single-ended surface-mounted package; 4 terminals; 4.9 mm x 4.45 mm x 1 mm body Marcom graphics 2017-01-28
SOT669 plastic, single-ended surface-mounted package; 4 terminals Package information 2022-05-30
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
BUK7Y10_30B BUK7Y10-30B SPICE model SPICE model 2012-04-11
TN00008 Power MOSFET frequently asked questions and answers Technical note 2023-01-12
BUK7Y10-30B_RC_Thermal_Model BUK7Y10-30B Thermal design model Thermal design 2021-01-18
BUK7Y10-30B BUK7Y10-30B Thermal model Thermal model 2009-06-22
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08

支持

如果您需要设计/技术支持,请告知我们并填写 应答表 我们会尽快回复您。

模型

文件名称 标题 类型 日期
BUK7Y10_30B BUK7Y10-30B SPICE model SPICE model 2012-04-11
BUK7Y10-30B_RC_Thermal_Model BUK7Y10-30B Thermal design model Thermal design 2021-01-18
BUK7Y10-30B BUK7Y10-30B Thermal model Thermal model 2009-06-22
SOT669 3D model for products with SOT669 package Design support 2017-06-30

How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.