双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

74LV164

8-bit serial-in/parallel-out shift register

The 74LV164 is an 8-bit serial-in/parallel-out shift register. The device features two serial data inputs (DSA and DSB), eight parallel outputs (Q0 to Q7). Data is entered serially through DSA or DSB and either input can be used as an active HIGH enable for data entry through the other input. Data is shifted on the LOW-to-HIGH transition of the clock input (CP). A LOW on the master reset input (MR) clears the register and forces all outputs LOW, independently of other inputs.

Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess VCC.

Features and benefits

  • Wide supply voltage range from 1.0 V to 5.5 V

  • CMOS low power dissipation

  • Optimized for low-voltage applications: 1.0 V to 3.6 V

  • Accepts TTL input levels between VCC = 2.7 V and VCC = 3.6 V

  • Typical VOLP (output ground bounce): < 0.8 V at VCC = 3.3 V and Tamb = 25 °C

  • Typical VOHV (output VOH undershoot): > 2 V at VCC = 3.3 V and Tamb = 25 °C

  • Gated serial data inputs

  • Asynchronous master reset

  • Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
  • Complies with JEDEC standards:
    • JESD8-7 (1.65 V to 1.95 V)
    • JESD8-5 (2.3 V to 2.7 V)
    • JESD8C (2.7 V to 3.6 V)
    • JESD36 (4.5 V to 5.5 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Specified from -40 °C to +80 °C and from -40 °C to +125 °C.

参数类型

型号 VCC (V) Logic switching levels Output drive capability (mA) tpd (ns) fmax (MHz) Nr of bits Power dissipation considerations Tamb (°C) Rth(j-a) (K/W) Ψth(j-top) (K/W) Rth(j-c) (K/W) Package name
74LV164BQ 1.0 - 5.5 TTL ± 12 12 78 8 low -40~125 92 9.1 58 DHVQFN14
74LV164D 1.0 - 5.5 TTL ± 12 12 78 8 low -40~125 90 7.9 47 SO14
74LV164PW 1.0 - 5.5 TTL ± 12 12 78 8 low -40~125 128 3.6 53.1 TSSOP14

封装

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
74LV164BQ 74LV164BQ,115
(935278654115)		 Active LV164 SOT762-1
DHVQFN14
(SOT762-1) 		SOT762-1 SOT762-1_115
74LV164D 74LV164D,118
(935067450118)		 Active 74LV164D SOT108-1
SO14
(SOT108-1) 		SOT108-1 SO-SOJ-REFLOW
SO-SOJ-WAVE
WAVE_BG-BD-1
SOT108-1_118
74LV164PW 74LV164PW,118
(935175240118)		 Active LV164 SOT402-1
TSSOP14
(SOT402-1) 		SOT402-1 SSOP-TSSOP-VSO-WAVE
SOT402-1_118

下表中的所有产品型号均已停产 。

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
74LV164DB 74LV164DB,112
(935170190112)		 Obsolete LV164 SOT337-1
SSOP14
(SOT337-1) 		SOT337-1 SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE
暂无信息
74LV164DB,118
(935170190118)		 Obsolete LV164 SOT337-1_118

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74LV164BQ 74LV164BQ,115 74LV164BQ rohs rhf rhf
74LV164D 74LV164D,118 74LV164D rohs rhf rhf
74LV164PW 74LV164PW,118 74LV164PW rohs rhf rhf

下表中的所有产品型号均已停产 。

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74LV164DB 74LV164DB,112 74LV164DB rohs rhf rhf
74LV164DB 74LV164DB,118 74LV164DB rohs rhf rhf
品质及可靠性免责声明

文档 (21)

文件名称 标题 类型 日期
74LV164 8-bit serial-in/parallel-out shift register Data sheet 2024-01-31
AN90063 Questions about package outline drawings Application note 2025-06-13
sv00384 Block diagram: 74LV164BQ, 74LV164D, 74LV164DB, 74LV164N, 74LV164PW Block diagram 2009-11-04
SOT762-1 3D model for products with SOT762-1 package Design support 2019-10-03
SOT108-1 3D model for products with SOT108-1 package Design support 2020-01-22
SOT402-1 3D model for products with SOT402-1 package Design support 2023-02-02
74lv164 74LV164 IBIS model IBIS model 2017-10-21
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DHVQFN14_SOT762-1_mk plastic, dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; 0.5 mm pitch; 2.5 mm x 3 mm x 0.85 mm body Marcom graphics 2017-01-28
SO14_SOT108-1_mk plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body Marcom graphics 2017-01-28
SSOP14_SOT337-1_mk plastic, shrink small outline package; 14 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body Marcom graphics 2017-01-28
TSSOP14_SOT402-1_mk plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body Marcom graphics 2017-01-28
SOT762-1 plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body Package information 2023-04-05
SOT108-1 plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body Package information 2023-11-07
SOT337-1 plastic, shrink small outline package; 14 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body Package information 2020-04-21
SOT402-1 plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body Package information 2023-11-07
SO-SOJ-REFLOW Footprint for reflow soldering Reflow soldering 2009-10-08
SSOP-TSSOP-VSO-REFLOW Footprint for reflow soldering Reflow soldering 2009-10-08
SO-SOJ-WAVE Footprint for wave soldering Wave soldering 2009-10-08
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08
SSOP-TSSOP-VSO-WAVE Footprint for wave soldering Wave soldering 2009-10-08

支持

如果您需要设计/技术支持，请告知我们并填写 应答表 我们会尽快回复您。

模型

文件名称 标题 类型 日期
SOT762-1 3D model for products with SOT762-1 package Design support 2019-10-03
SOT108-1 3D model for products with SOT108-1 package Design support 2020-01-22
SOT402-1 3D model for products with SOT402-1 package Design support 2023-02-02
74lv164 74LV164 IBIS model IBIS model 2017-10-21

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