双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

LSF0101

1-bit bidirectional multi-voltage level translator; open-drain; push-pull

The LSF0101 is an 1 channel bidirectional multi-voltage level translator for open-drain and push-pull applications. It supports up to 100 MHz up translation and ≥ 100 MHz down translation at ≤ 30 pF capacitive load. There is no need for a direction pin which minimizes system effort. The LSF0101 supports 5 V tolerant I/O pins for compatibility with TTL levels in a variety of applications. The ability to set up different voltage translation levels on each channel makes the device very flexible and suitable for a lot of different applications.

Features and benefits

  • Bidirectional voltage translation with no direction pin

  • Up translation

    • ≤ 100 MHz; CL = 30 pF

    • ≤ 50 MHz; CL = 50 pF

  • Down translation

    • ≥ 100 MHz; CL = 30 pF

    • ≥ 50 MHz; CL = 50 pF

  • Hot insertion

  • Bidirectional voltage level translation between:

    • 0.95 V and 1.8 V, 2.5 V, 3.3 V and 5.0 V

    • 1.2 V and 1.8 V, 2.5 V, 3.3 V and 5.0 V

    • 1.8 V and 2.5 V, 3.3 V and 5.0 V

    • 2.5 V and 3.3 V and 5.0 V

    • 3.3 V and 5.0 V

  • Low standby current

  • 5 V tolerant I/O pins to support TTL

  • Low RON provides less signal distortion

  • High-impedance I/O pins for EN = Low.

  • Flow-through pinout for easy PCB trace routing.

  • Latch-up performance exceeds 100 mA per JESD78 class II level A

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +125 °C

Applications

  • GPIO, MDIO, PMBus, SMBus, SDIO, UART, I2C, and other interfaces in Telecom infrastructure

  • Industrial

  • Personal computing

参数类型

型号 VCC(A) (V) VCC(B) (V) Logic switching levels Output drive capability (mA) tpd (ns) Nr of bits Power dissipation considerations Tamb (°C) Rth(j-a) (K/W) Ψth(j-top) (K/W) Rth(j-c) (K/W) Package name Category
LSF0101GM 0.95 - 5.0 0.95 - 5.0 CMOS + 64 0.7 1 low -40~125 302 7.2 153 XSON6 Bi-directional | AutoSense
LSF0101GW 0.95 - 5.0 0.95 - 5.0 CMOS + 64 0.7 1 low -40~125 273 46.6 161 TSSOP6 Bi-directional | AutoSense
LSF0101GW-Q100 0.95 - 5.0 0.95 - 5.0 CMOS + 64 0.7 1 low -40~125 273 46.6 161 TSSOP6 Bi-directional | AutoSense
LSF0101GX 0.95 - 5.0 0.95 - 5.0 CMOS + 64 0.7 1 low -40~125 521 22.4 278 X2SON6 Bi-directional | AutoSense

封装

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
LSF0101GM LSF0101GMX
(935690956115)		 Active h1 SOT886
XSON6
(SOT886) 		SOT886 REFLOW_BG-BD-1
SOT886_115
LSF0101GW LSF0101GWH
(935690295125)		 Active h1 SOT363-2
TSSOP6
(SOT363-2) 		SOT363-2 SOT363-2_125
LSF0101GW-Q100 LSF0101GW-Q100H
(935691326125)		 Active h1 SOT363-2
TSSOP6
(SOT363-2) 		SOT363-2 SOT363-2_125
LSF0101GX LSF0101GXZ
(935690296147)		 Active h1 SOT1255-2
X2SON6
(SOT1255-2) 		SOT1255-2 SOT1255-2_147

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
LSF0101GM LSF0101GMX LSF0101GM rohs rhf rhf
LSF0101GW LSF0101GWH LSF0101GW rohs rhf rhf
LSF0101GW-Q100 LSF0101GW-Q100H LSF0101GW-Q100 rohs rhf rhf
LSF0101GX LSF0101GXZ LSF0101GX rohs rhf rhf
品质及可靠性免责声明

文档 (14)

文件名称 标题 类型 日期
LSF0101 1-bit bidirectional multi-voltage level translator; open-drain; push-pull Data sheet 2024-07-25
AN90063 Questions about package outline drawings Application note 2025-06-13
Nexperia_document_guide_MiniLogic_MicroPak_201808 MicroPak leadless logic portfolio guide Brochure 2018-09-03
SOT886 3D model for products with SOT886 package Design support 2019-10-03
SOT363-2 3D model for products with SOT363-2 package Design support 2023-02-02
SOT1255-2 3D model for products with SOT1255-2 package Design support 2021-01-28
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DFN1410-6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
XSON6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
SOT886 plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Package information 2022-06-01
SOT363-2 plastic thin shrink small outline package; 6 leads; body width 1.25 mm Package information 2022-11-21
SOT1255-2 plastic thermal enhanced extremely thin small outline package; no leads;6 terminals; body 1.0 x 0.8 x 0.32 mm Package information 2020-08-27
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
MAR_SOT886 MAR_SOT886 Topmark Top marking 2013-06-03

支持

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模型

文件名称 标题 类型 日期
SOT886 3D model for products with SOT886 package Design support 2019-10-03
SOT363-2 3D model for products with SOT363-2 package Design support 2023-02-02
SOT1255-2 3D model for products with SOT1255-2 package Design support 2021-01-28

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