双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

74HCS264-Q100

8-bit serial-in, parallel-out shift register with Schmitt-trigger inputs and inverting outputs

The 74HCS264-Q100 is an 8-bit serial-in/parallel-out shift register. The device features two serial data inputs (DSA and DSB), eight parallel inverting data outputs (Q0 to Q7). Data is entered serially through DSA or DSB and either input can be used as an active HIGH enable for data entry through the other input. Data is shifted on the LOW-to-HIGH transitions of the clock (CP) input. A LOW on the master reset input (MR) clears the register and forces all outputs HIGH, independently of other inputs. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of VCC.

All inputs are Schmitt-trigger inputs, capable of transforming slowly changing input signals into sharply defined, jitter-free output signals.

This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.

Features and benefits

  • Automotive product qualification in accordance with AEC-Q100 (Grade 1)

    • Specified from -40 °C to +85 °C and from -40 °C to +125 °C

  • Wide supply voltage range from 2.0 V to 6.0 V

  • Schmitt-trigger inputs
  • Low power consumption
    • Typical supply current (ICC) of 100 nA
    • Typical input leakage current (II) of ±10 nA
  • ±7.8 mA output drive at 6 V

  • 8-bit serial input and 8-bit serial or parallel output

  • Storage register with 3-state outputs

  • Shift register with direct clear

  • Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
  • Complies with JEDEC standards:
    • JESD7A (2.0 V to 6.0 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 4000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1500 V

  • Multiple package options

  • DHVQFN package with Side-Wettable Flanks enabling Automated Optical Inspection (AOI) of solder joints

Applications

  • Serial-to-parallel data conversion

  • Remote control holding register

  • Output expansion

  • LED matrix control

  • 7-segment display control

  • 8-bit data storage

参数类型

型号 VCC (V) Logic switching levels Output drive capability (mA) tpd (ns) fmax (MHz) Power dissipation considerations Tamb (°C) Package name
74HCS264BQ-Q100 2.0 - 6.0 CMOS ± 7.8 7 97 low -40~125 DHVQFN14
74HCS264D-Q100 2.0 - 6.0 CMOS ± 7.8 7 97 low -40~125 SO14
74HCS264PW-Q100 2.0 - 6.0 CMOS ± 7.8 7 97 low -40~125 TSSOP14

封装

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
74HCS264BQ-Q100 74HCS264BQ-Q100X
(935691479115)		 Active CS264 SOT762-1
DHVQFN14
(SOT762-1) 		SOT762-1 SOT762-1_115
74HCS264D-Q100 74HCS264D-Q100J
(935691900118)		 Active 74HCS264D SOT108-1
SO14
(SOT108-1) 		SOT108-1 SO-SOJ-REFLOW
SO-SOJ-WAVE
WAVE_BG-BD-1
SOT108-1_118
74HCS264PW-Q100 74HCS264PW-Q100J
(935691482118)		 Active HCS264 SOT402-1
TSSOP14
(SOT402-1) 		SOT402-1 SSOP-TSSOP-VSO-WAVE
SOT402-1_118

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74HCS264BQ-Q100 74HCS264BQ-Q100X 74HCS264BQ-Q100 rohs rhf rhf
74HCS264D-Q100 74HCS264D-Q100J 74HCS264D-Q100 rohs rhf rhf
74HCS264PW-Q100 74HCS264PW-Q100J 74HCS264PW-Q100 rohs rhf rhf
品质及可靠性免责声明

文档 (17)

文件名称 标题 类型 日期
74HCS264_Q100 8-bit serial-in, parallel-out shift register with Schmitt-trigger inputs and inverting outputs Data sheet 2025-06-18
AN90063 Questions about package outline drawings Application note 2025-06-13
SOT762-1 3D model for products with SOT762-1 package Design support 2019-10-03
SOT108-1 3D model for products with SOT108-1 package Design support 2020-01-22
SOT402-1 3D model for products with SOT402-1 package Design support 2023-02-02
74hcs264 74HCS264 IBIS Model IBIS model 2025-06-30
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DHVQFN14_SOT762-1_mk plastic, dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; 0.5 mm pitch; 2.5 mm x 3 mm x 0.85 mm body Marcom graphics 2017-01-28
SO14_SOT108-1_mk plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body Marcom graphics 2017-01-28
TSSOP14_SOT402-1_mk plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body Marcom graphics 2017-01-28
SOT762-1 plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body Package information 2023-04-05
SOT108-1 plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body Package information 2023-11-07
SOT402-1 plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body Package information 2023-11-07
SO-SOJ-REFLOW Footprint for reflow soldering Reflow soldering 2009-10-08
SO-SOJ-WAVE Footprint for wave soldering Wave soldering 2009-10-08
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08
SSOP-TSSOP-VSO-WAVE Footprint for wave soldering Wave soldering 2009-10-08

支持

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模型

文件名称 标题 类型 日期
SOT762-1 3D model for products with SOT762-1 package Design support 2019-10-03
SOT108-1 3D model for products with SOT108-1 package Design support 2020-01-22
SOT402-1 3D model for products with SOT402-1 package Design support 2023-02-02
74hcs264 74HCS264 IBIS Model IBIS model 2025-06-30

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