双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

74HCS541

Octal buffer/line driver with Schmitt-trigger inputs; 3-state

The 74HCS541 is an octal non-inverting buffer/line driver with 3-state outputs. The device features two output enables (OE1 and OE2). A HIGH on OEn causes the outputs to assume a high-impedance OFF-state. Inputs include clamp diodes that enable the use of current limiting resistors to interface inputs to voltages in excess of VCC.

All inputs are Schmitt-trigger inputs, capable of transforming slowly changing input signals into sharply defined, jitter-free output signals.

Features and benefits

  • Wide supply voltage range from 2.0 V to 6.0 V

  • Schmitt-trigger inputs

  • Non-Inverting outputs

  • Low power consumption
    • Typical supply current (ICC) of 100 nA
    • Typical input leakage current (II) of ±10 nA
  • ±7.8 mA output drive at 6 V
  • Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
  • Complies with JEDEC standards:
    • JESD7A (2.0 V to 6.0 V)

  • ESD protection:

    • HBM ANSI/ESDA/JEDEC JS-001 class 3A exceeds 4000 V

    • CDM ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1500 V

  • Specified from -40 °C to +85 °C and from -40 °C to +125 °C

参数类型

型号 VCC (V) Logic switching levels Power dissipation considerations Tamb (°C) Package name
74HCS541BQ 2.0 - 6.0 CMOS low -40~125 DHVQFN20
74HCS541PW 2.0 - 6.0 CMOS low -40~125 TSSOP20

封装

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
74HCS541BQ 74HCS541BQX
(935692466115)		 Active S541 SOT764-1
DHVQFN20
(SOT764-1) 		SOT764-1 SOT764-1_115
74HCS541PW 74HCS541PWJ
(935692464118)		 Active S541 SOT360-1
TSSOP20
(SOT360-1) 		SOT360-1 SSOP-TSSOP-VSO-WAVE
SOT360-1_118

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74HCS541BQ 74HCS541BQX 74HCS541BQ rohs rhf rhf
74HCS541PW 74HCS541PWJ 74HCS541PW rohs rhf rhf
品质及可靠性免责声明

文档 (11)

文件名称 标题 类型 日期
74HCS541 Octal buffer/line driver with Schmitt-trigger inputs; 3-state Data sheet 2025-10-24
AN90063 Questions about package outline drawings Application note 2025-10-22
SOT764-1 3D model for products with SOT764-1 package Design support 2019-10-03
SOT360-1 3D model for products with SOT360-1 package Design support 2020-01-22
74hcs541 74HCS541 IBIS model IBIS model 2025-10-26
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DHVQFN20_SOT764-1_mk plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body Marcom graphics 2017-01-28
TSSOP20_SOT360-1_mk plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body Marcom graphics 2017-01-28
SOT764-1 plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body Package information 2022-06-21
SOT360-1 plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body Package information 2024-11-15
SSOP-TSSOP-VSO-WAVE Footprint for wave soldering Wave soldering 2009-10-08

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模型

文件名称 标题 类型 日期
SOT764-1 3D model for products with SOT764-1 package Design support 2019-10-03
SOT360-1 3D model for products with SOT360-1 package Design support 2020-01-22
74hcs541 74HCS541 IBIS model IBIS model 2025-10-26

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