双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

74HCS74-Q100

Dual D-type flip-flop with Schmitt-trigger inputs; set and reset; positive edge-trigger

The 74HCS74-Q100 is a dual positive edge triggered D-type flip-flop. They have individual data (nD), clock (nCP), set (nSD) and reset (nRD) inputs, and complementary nQ and nQ outputs. Data at the nD-input, that meets the set-up and hold time requirements on the LOW-to-HIGH clock transition, is stored in the flip-flop and appears at the nQ output. Inputs include clamp diodes that enable the use of current limiting resistors to interface inputs to voltages in excess of VCC.

All inputs are Schmitt-trigger inputs, capable of transforming slowly changing input signals into sharply defined, jitter-free output signals.

This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.

Features and benefits

  • Automotive product qualification in accordance with AEC-Q100 (Grade 1)

    • Specified from -40 °C to +85 °C and from -40 °C to +125 °C

  • Wide supply voltage range from 2.0 V to 6.0 V

  • Schmitt-trigger inputs
  • Low power consumption
    • Typical supply current (ICC) of 100 nA
    • Typical input leakage current (II) of ±10 nA
  • ±7.8 mA output drive at 6 V

  • Symmetrical output impedance

  • Balanced propagation delays

  • Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
  • Complies with JEDEC standards:
    • JESD7A (2.0 V to 6.0 V)

  • ESD protection:

    • HBM ANSI/ESDA/JEDEC JS-001 class 3A exceeds 4000 V

    • CDM ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1500 V

  • Multiple package options

  • DHVQFN package with Side-Wettable Flanks enabling Automated Optical Inspection (AOI) of solder joints

参数类型

型号 VCC (V) Logic switching levels Power dissipation considerations Tamb (°C) Package name
74HCS74BQ-Q100 2.0 - 6.0 CMOS low -40~125 DHVQFN14
74HCS74D-Q100 2.0 - 6.0 CMOS low -40~125 SO14
74HCS74PW-Q100 2.0 - 6.0 CMOS low -40~125 TSSOP14

封装

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
74HCS74BQ-Q100 74HCS74BQ-Q100X
(935692299115)		 Active HCS74 SOT762-1
DHVQFN14
(SOT762-1) 		SOT762-1 SOT762-1_115
74HCS74D-Q100 74HCS74D-Q100J
(935692300118)		 Active 74HCS74D SOT108-1
SO14
(SOT108-1) 		SOT108-1 SO-SOJ-REFLOW
SO-SOJ-WAVE
WAVE_BG-BD-1
SOT108-1_118
74HCS74PW-Q100 74HCS74PW-Q100J
(935692298118)		 Active HCS74 SOT402-1
TSSOP14
(SOT402-1) 		SOT402-1 SSOP-TSSOP-VSO-WAVE
SOT402-1_118

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74HCS74BQ-Q100 74HCS74BQ-Q100X 74HCS74BQ-Q100 rohs rhf rhf
74HCS74D-Q100 74HCS74D-Q100J 74HCS74D-Q100 rohs rhf rhf
74HCS74PW-Q100 74HCS74PW-Q100J 74HCS74PW-Q100 rohs rhf rhf
品质及可靠性免责声明

文档 (17)

文件名称 标题 类型 日期
74HCS74_Q100 Dual D-type flip-flop with Schmitt-trigger inputs; set and reset; positive edge-trigger Data sheet 2025-07-21
AN90063 Questions about package outline drawings Application note 2025-06-13
SOT762-1 3D model for products with SOT762-1 package Design support 2019-10-03
SOT108-1 3D model for products with SOT108-1 package Design support 2020-01-22
SOT402-1 3D model for products with SOT402-1 package Design support 2023-02-02
74hcs74 74HCS74 IBIS Model IBIS model 2025-07-01
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DHVQFN14_SOT762-1_mk plastic, dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; 0.5 mm pitch; 2.5 mm x 3 mm x 0.85 mm body Marcom graphics 2017-01-28
SO14_SOT108-1_mk plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body Marcom graphics 2017-01-28
TSSOP14_SOT402-1_mk plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body Marcom graphics 2017-01-28
SOT762-1 plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body Package information 2023-04-05
SOT108-1 plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body Package information 2023-11-07
SOT402-1 plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body Package information 2023-11-07
SO-SOJ-REFLOW Footprint for reflow soldering Reflow soldering 2009-10-08
SO-SOJ-WAVE Footprint for wave soldering Wave soldering 2009-10-08
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08
SSOP-TSSOP-VSO-WAVE Footprint for wave soldering Wave soldering 2009-10-08

支持

如果您需要设计/技术支持，请告知我们并填写 应答表 我们会尽快回复您。

模型

文件名称 标题 类型 日期
SOT762-1 3D model for products with SOT762-1 package Design support 2019-10-03
SOT108-1 3D model for products with SOT108-1 package Design support 2020-01-22
SOT402-1 3D model for products with SOT402-1 package Design support 2023-02-02
74hcs74 74HCS74 IBIS Model IBIS model 2025-07-01

Ordering, pricing & availability

样品

作为 Nexperia 的客户，您可以通过我们的销售机构订购样品。

如果您没有 Nexperia 的直接账户，我们的全球和地区分销商网络可为您提供 Nexperia 样品支持。查看官方经销商列表。