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74LVC1G175

Single D-type flip-flop with reset; positive-edge trigger

The 74LVC1G175 is a low-power, low-voltage single positive edge triggered D-type flip-flop with individual data (D) input, clock (CP) input, master reset (MR) input, and Q output.

The master reset (MR) is an asynchronous active LOW input and operates independently of the clock input. Information on the data input is transferred to the Q output on the LOW-to-HIGH transition of the clock pulse. The D input must be stable one set-up time prior to the LOW-to-HIGH clock transition for predictable operation.

The inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of this device in a mixed 3.3 V and 5 V environment.

This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.

Schmitt trigger action at all inputs makes the circuit highly tolerant of slower input rise and fall times.

特性

  • Wide supply voltage range from 1.65 V to 5.5 V

  • High noise immunity

  • Overvoltage tolerant inputs to 5.5 V

  • ±24 mA output drive (VCC = 3.0 V)

  • CMOS low power dissipation

  • Direct interface with TTL levels

  • IOFF circuitry provides partial Power-down mode operation

  • Latch-up performance exceeds 250 mA

  • Complies with JEDEC standard:

    • JESD8-7 (1.65 V to 1.95 V)

    • JESD8-5 (2.3 V to 2.7 V)

    • JESD8C (2.7 V to 3.6 V)

    • JESD36 (4.5 V to 5.5 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C.

参数类型

Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)tpd (ns)fmax (MHz)Power dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
74LVC1G175GMProduction1.65 - 5.5CMOS/LVTTL± 323.1300low-40~1252916.6145XSON6
74LVC1G175GNProduction1.65 - 5.5CMOS/LVTTL± 323.1300low-40~12527712.1172XSON6
74LVC1G175GSProduction1.65 - 5.5CMOS/LVTTL± 323.1300low-40~12527315.3178XSON6
74LVC1G175GVProduction1.65 - 5.5CMOS/LVTTL± 323.1300low-40~12523240.0146TSOP6
74LVC1G175GWProduction1.65 - 5.5CMOS/LVTTL± 323.1300low-40~12526539.1154TSSOP6

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
74LVC1G175GM
XSON6
(SOT886) 		SOT886REFLOW_BG-BD-1
SOT886_132ActiveYT74LVC1G175GM,132
( 9352 772 08132 )
SOT886_115ActiveYT74LVC1G175GM,115
( 9352 772 08115 )
74LVC1G175GN
XSON6
(SOT1115) 		SOT1115REFLOW_BG-BD-1
SOT1115_132ActiveYT74LVC1G175GN,132
( 9352 917 79132 )
74LVC1G175GS
XSON6
(SOT1202) 		SOT1202REFLOW_BG-BD-1
SOT1202_132ActiveYT74LVC1G175GS,132
( 9352 929 05132 )
74LVC1G175GV
TSOP6
(SOT457) 		SOT457REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT457_125ActiveV7574LVC1G175GV,125
( 9352 749 47125 )
74LVC1G175GW
TSSOP6
(SOT363-2) 		SOT363-2SOT363-2_125ActiveYT74LVC1G175GW,125
( 9352 749 48125 )

停产信息

型号可订购的器件编号，（订购码(12NC)）最后一次购买日期最后一次交货日期替代产品状态备注
74LVC1G175GW935274948165

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
74LVC1G175GM74LVC1G175GM,13274LVC1G175GMAlways Pb-free
74LVC1G175GM74LVC1G175GM,11574LVC1G175GMAlways Pb-free
74LVC1G175GN74LVC1G175GN,13274LVC1G175GNAlways Pb-free
74LVC1G175GS74LVC1G175GS,13274LVC1G175GSAlways Pb-free
74LVC1G175GV74LVC1G175GV,12574LVC1G175GVAlways Pb-free
74LVC1G175GW74LVC1G175GW,12574LVC1G175GWAlways Pb-free
品质及可靠性免责声明

文档 (19)

文件名称标题类型日期
74LVC1G175Single D-type flip-flop with reset; positive-edge triggerData sheet2023-08-15
AN10161PicoGate Logic footprintsApplication note2002-10-29
AN11009Pin FMEA for LVC familyApplication note2019-01-09
lvc1g17574LVC1G175 IBIS modelIBIS model2014-10-20
Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1202MAR_SOT1202 TopmarkTop marking2013-06-03
SOT1202plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm bodyPackage information2022-06-01
SOT363-2plastic thin shrink small outline package; 6 leads; body width 1.25 mmPackage information2022-11-21
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1115MAR_SOT1115 TopmarkTop marking2013-06-03
SOT1115plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm bodyPackage information2022-05-27
MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03
SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2022-06-01
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT457MAR_SOT457 TopmarkTop marking2013-06-03
WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08
SOT457plastic, surface-mounted package (SC-74; TSOP6); 6 leadsPackage information2023-03-03
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06

支持

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模型

文件名称标题类型日期
lvc1g17574LVC1G175 IBIS modelIBIS model2014-10-20

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