NEVB-LOGIC01封装尺寸适配板
NEVB-LOGIC01是一款双列内嵌式逻辑器件封装尺寸适配板，其设计旨在通过提供多种封装尺寸，简化对Nexperia逻辑器件的评估过程。
NEVB-LOGIC01封装尺寸适配板
主要特性与优势
• 即插即用：确认待使用的封装，将器件放入相应封装尺寸中，焊接固定器件，即可开始评估。
• 兼容多种封装：
TSSOP14/16
TSSOP20
TSSOP24
DHVQFN14/16
DHVQFN20
DHVQFN24
QFN12
Packages on the board (7)
| 封装 | 封装名称 | 封装版本 | 封装说明 | 参考 | 发行日期 |
|---|---|---|---|---|---|
TSSOP14 (SOT402-1) |
TSSOP14 | SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | MO-153 (JEDEC) | 2023-10-27 |
TSSOP20 (SOT360-1) |
TSSOP20 | SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body | MO-153 (JEDEC) | 2003-02-07 |
TSSOP24 (SOT355-1) |
TSSOP24 | SOT355-1 | plastic, thin shrink small outline package; 24 leads; 0.65 mm pitch; 7.8 mm x 4.4 mm x 1.2 mm body | MO-153 (JEDEC) | 2024-11-07 |
DHVQFN16 (SOT763-1) |
DHVQFN16 | SOT763-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body | MO-241 (JEDEC) | 2003-01-27 |
DHVQFN20 (SOT764-1) |
DHVQFN20 | SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | MO-241 (JEDEC) | 2014-12-12 |
DHVQFN24 (SOT815-1) |
DHVQFN24 | SOT815-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 24 terminals; 0.5 mm pitch; 5.5 mm x 3.5 mm x 1 mm body | 2003-04-29 | |
XQFN12 (SOT1174-1) |
XQFN12 | SOT1174-1 | plastic, leadless extremely thin quad flat package; 12 terminals; 0.4 mm pitch; 2 mm x 1.7 mm x 0.5 mm body | MO-288 (JEDEC) | 2010-04-21 |
相关板块 (3)
| Board | Description | Type | Quick links | Shop link | |
|---|---|---|---|---|---|
|
nevb-logic02-footprint-adapter-board | NEVB-LOGIC02 footprint adapter board | Evaluation board | ||
|
nevb-logic03-footprint-adapter-board | NEVB-LOGIC03 footprint adapter board | Evaluation board | ||
|
nevb-logic04-footprint-adapter-board | Logic footprint adapter board (NEVB-LOGIC04) | Evaluation board |
Packages on the board (7)
| 封装 | 封装名称 | 封装版本 | 封装说明 | 参考 | 发行日期 |
|---|---|---|---|---|---|
|
TSSOP14 (SOT402-1) |
TSSOP14 | SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | MO-153 (JEDEC) | 2023-10-27 |
|
TSSOP20 (SOT360-1) |
TSSOP20 | SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body | MO-153 (JEDEC) | 2003-02-07 |
|
TSSOP24 (SOT355-1) |
TSSOP24 | SOT355-1 | plastic, thin shrink small outline package; 24 leads; 0.65 mm pitch; 7.8 mm x 4.4 mm x 1.2 mm body | MO-153 (JEDEC) | 2024-11-07 |
|
DHVQFN16 (SOT763-1) |
DHVQFN16 | SOT763-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body | MO-241 (JEDEC) | 2003-01-27 |
|
DHVQFN20 (SOT764-1) |
DHVQFN20 | SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | MO-241 (JEDEC) | 2014-12-12 |
|
DHVQFN24 (SOT815-1) |
DHVQFN24 | SOT815-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 24 terminals; 0.5 mm pitch; 5.5 mm x 3.5 mm x 1 mm body | 2003-04-29 | |
|
XQFN12 (SOT1174-1) |
XQFN12 | SOT1174-1 | plastic, leadless extremely thin quad flat package; 12 terminals; 0.4 mm pitch; 2 mm x 1.7 mm x 0.5 mm body | MO-288 (JEDEC) | 2010-04-21 |
相关板块 (3)
| Board | Description | Type | Quick links | Shop link | |
|---|---|---|---|---|---|
|
|
nevb-logic02-footprint-adapter-board | NEVB-LOGIC02 footprint adapter board | Evaluation board | ||
|
|
nevb-logic03-footprint-adapter-board | NEVB-LOGIC03 footprint adapter board | Evaluation board | ||
|
|
nevb-logic04-footprint-adapter-board | Logic footprint adapter board (NEVB-LOGIC04) | Evaluation board |
文档 (1)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| nexperia_factsheet_dual_in_line_logic_footprint_adapter_boards | Dual in-line Logic footprint adapter boards | Leaflet | 2024-01-24 |