外形图
| 封装版本 | 封装名称 | 封装说明 | 参考 | 发行日期 |
|---|---|---|---|---|
| DFN1616-6 | plastic, leadless thermal enhanced extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1.6 mm x 1.6 mm x 0.5 mm body | - - - (EIAJ); - - - (JEDEC) | 2010-10-11 |
相关文档
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| Nexperia_document_brochure_ESD-Protection-Applications_022017 | ESD Protection Application guide | Brochure | 2018-12-21 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |