外形图
| 封装版本 | 封装名称 | 封装说明 | 参考 | 发行日期 |
|---|---|---|---|---|
| SOT8083-1 | HTSSOP24 | plastic, thermal enhanced thin shrink small outline package; 24 leads; 0.65 mm pitch; 7.8 mm × 4.4 mm × 1.2 mm body | MO-153 (JEDEC) | 2024-12-24 |
相关文档
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT8083-1 | plastic, thermal enhanced thin shrink small outline package; 24 leads; 0.65 mm pitch; 7.8 mm × 4.4 mm × 1.2 mm body | Package information | 2025-01-10 |
| SOT8083-1_518 | HTSSOP24; Reel dry pack for SMD 13''; Q1/T1 product orientation | Packing information | 2024-06-18 |
采用此封装的产品
Analog & Logic ICs
| 型号 | 描述 | 快速访问 |
|---|---|---|
| NEX13120PC-Q100 | 12-channel automotive linear LED driver | |
| NEX13120FPC-Q100 | 12-channel automotive linear LED driver |
Automotive qualified products (AEC-Q100/Q101)
| 型号 | 描述 | 快速访问 |
|---|---|---|
| NEX13120PC-Q100 | 12-channel automotive linear LED driver | |
| NEX13120FPC-Q100 | 12-channel automotive linear LED driver |