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HEF40175B-Q100

Quad D-type flip-flop

The HEF40175B-Q100 is a quad positive edge triggered D-type flip-flop with four data (Dn) inputs, common clock (CP) and asynchronous master reset (MR) inputs, and complementary Qn and Qn outputs. When MR is HIGH data at the D-input that meets the set-up and hold time requirements on the LOW-to-HIGH clock transition will be stored in the flip-flop and appear at the Q output. When LOW, MR resets all flip-flops (Qn = LOW, Qn = HIGH), independent of CP and Dn. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of VDD.

This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.

特性

  • Automotive product qualification in accordance with AEC-Q100 (Grade 1)

    • Specified from -40 °C to +85 °C and from -40 °C to +125 °C

  • Wide supply voltage range from 3.0 V to 15.0 V

  • CMOS low power dissipation

  • High noise immunity

  • Fully static operation

  • 5 V, 10 V, and 15 V parametric ratings

  • Standardized symmetrical output characteristics

  • Complies with JEDEC standard JESD 13-B

  • ESD protection:

    • HBM JESD22-A114F exceeds 2000 V

    • MM JESD22-A115-B exceeds 200 V

目标应用

  • Shift registers

  • Buffer/storage register

  • Pattern generator

参数类型

Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)tpd (ns)fmax (MHz)Power dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
HEF40175BTT-Q100Production3.0 - 15CMOS± 2.42545low-40~851152.243.2TSSOP16

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
HEF40175BTT-Q100
TSSOP16
(SOT403-1) 		SOT403-1SSOP-TSSOP-VSO-WAVE
SOT403-1_118ActiveHF40175HEF40175BTT-Q100J
( 9356 916 15118 )

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
HEF40175BTT-Q100HEF40175BTT-Q100JHEF40175BTT-Q100
品质及可靠性免责声明

文档 (3)

文件名称标题类型日期
HEF40175B_Q100Quad D-type flip-flopData sheet2023-10-20
SOT403-1plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm bodyPackage information2023-11-08
SSOP-TSSOP-VSO-WAVEFootprint for wave solderingWave soldering2009-10-08

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