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LSF0108-Q100

8-bit bidirectional multi-voltage level translator; open-drain; push-pull

The LSF0108-Q100 is an 8 Channel bidirectional multi-voltage level translator for open-drain and push-pull applications. It supports up to 100 MHz up translation and ≥ 100 MHz down translation at ≤ 30 pF capacitive load. There is no need for a direction pin which minimizes system effort. The LSF0108-Q100 supports 5 V tolerant I/O pins for compatibility with TTL levels in a variety of applications. The ability to set up different voltage translation levels on each channel makes the device very flexible and suitable for a lot of different applications.

This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.

特性

  • Automotive product qualification in accordance with AEC-Q100 (Grade 1)
    • Specified from -40 °C to +125 °C
  • Bidirectional voltage translation with no direction pin
  • Up translation
    • ≤ 100 MHz; CL = 30 pF
    • ≤ 40 MHz; CL = 50 pF
  • Down translation
    • ≥ 100 MHz; CL = 30 pF
    • ≤ 40 MHz; CL = 50 pF
  • Hot insertion
  • Bidirectional voltage level translation between:
    • 0.95 V and 1.8 V, 2.5 V, 3.3 V and 5.0 V
    • 1.2 V and 1.8 V, 2.5 V, 3.3 V and 5.0 V
    • 1.8 V and 2.5 V, 3.3 V and 5.0 V
    • 2.5 V and 3.3 V and 5.0 V
    • 3.3 V and 5.0 V
  • Low standby current
  • 5 V tolerant I/O pins to support TTL
  • Low RON provides less signal distortion
  • High-impedance I/O pins for EN = Low.
  • Flow-through pinout for easy PCB trace routing.
  • Latch-up performance exceeds 100 mA per JESD78 class II level A
  • ESD protection:
    • HBM ANSI/ESDA/JEDEC JS-001 exceeds 2000 V
    • CDM ANSI/ESDA/JEDEC JS-002 exceeds 1000 V
  • DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints

目标应用

  • GPIO, MDIO, PMBus, SMBus, SDIO, UART, I²C, and other interfaces in Telecom infrastructure
  • Industrial
  • Personal computing
  • Automotive

参数类型

Type numberProduct statusVCC(A) (V)VCC(B) (V)Logic switching levelsOutput drive capability (mA)tpd (ns)No of bitsPower dissipation considerationsTamb (°C)Ψth(j-top) (K/W)Package name
LSF0108BQ-Q100Production0.95 - 5.00.95 - 5.0CMOSn.a.1.48low-40~1250.0DHVQFN20
LSF0108PW-Q100Production0.95 - 5.00.95 - 5.0CMOSn.a.1.48low-40~1250.0TSSOP20

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号,(订购码(12NC))
LSF0108BQ-Q100
DHVQFN20
(SOT764-1)
SOT764-1Reel 7” Q1/T1 or Q2/T3ActiveLSF0108LSF0108BQ-Q100X
( 9356 909 19115 )
LSF0108PW-Q100
TSSOP20
(SOT360-1)
SOT360-1SSOP-TSSOP-VSO-WAVE
Reel 13" Q1/T1ActiveLSF0108LSF0108PW-Q100J
( 9356 909 18118 )

品质、可靠性及化学成分

型号可订购的器件编号化学成分RoHS / RHF无铅转换日期EFRIFRMTBF(小时)MSLMSL无铅
LSF0108BQ-Q100LSF0108BQ-Q100XLSF0108BQ-Q10050.40.81.25E911
LSF0108PW-Q100LSF0108PW-Q100JLSF0108PW-Q10050.40.81.25E911
品质及可靠性免责声明

文档 (5)

文件名称标题类型日期
LSF0108_Q1008-bit bidirectional multi-voltage level translator; open-drain; push-pullData sheet2020-07-30
lsf0108LSF0108 IBIS modelIBIS model2020-04-14
SOT764-1plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm bodyPackage information2021-08-17
SSOP-TSSOP-VSO-WAVEFootprint for wave solderingWave soldering2009-10-08
SOT360-1plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm bodyPackage information2020-04-21

支持

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模型

文件名称标题类型日期
lsf0108LSF0108 IBIS modelIBIS model2020-04-14

订购、定价与供货

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